Melexis is to exhibit at the upcoming CAR ELE in Tokyo, 18-20 January 2017.
The CAR ELE event is recognised as key to continued technological innovation in the automotive industry. This year’s attendees will have the opportunity to access to the latest innovations from Melexis – in relation to in-vehicle networking, 3D imaging and temperature sensing – through a series of interactive demos.
The LIN RGB demo illustrates the advances Melexis is making in the personalisation of vehicles’ interior lighting, based on the brand new MLX81115 dual-channel driver IC. With built-in 16-bit microcontroller and 32kBytes of Flash memory, this IC enables the control of multiple LEDs through the LIN bus, with color mixing and color calibration functions being taken care of. It can also compensate for temperature changes and alteration to LED output characteristics over their lifetime.
The optical Time of-Flight (ToF) 3D imaging demo showcases Melexis’ next generation of ToF semiconductor technology. This provides a streamlined ToF sensing solution that is unique in being optimised for automotive implementation, thanks to its sunlight robustness and its ability to operate at elevated temperature levels. Visitors to the Melexis’ stand will be able to witness the capturing of detailed QVGA resolution ToF imaging data in real time for use by a vehicle’s ADAS.
Melexis’ recently released MLX90640 is a 32 x 24 pixel resolution infrared (IR) sensor array that can deliver noise performance, high temperature accuracy and quick responsiveness. It provides a more compact alternative to high-end thermal cameras, via use of signal-enhanced thermopile technology.
All three products will be demonstrated at CAR ELE.