News

HENSOLDT to deliver radars for Quadriga Eurofighters

Sensor systems supplier HENSOLDT has been awarded a contract worth approximately 200 million euros in the frame of ‘Quadriga’ procurement programme of 38 Eurofighter/Typhoon combat aircraft by the German Air Force. The contract placed by Airbus Defence and Space comprises production and delivery of radar systems and core electronics components which will be produced at HENSOLDT’s site in Ulm and at consortium partner Indra’s site in Spain.

“The high pace of development in the field of electronics and, above all, digitalisation constantly gives rise to new applications. With this contract, the Eurofighter will benefit in the future from a primary sensor that is technologically top class and will improve the aircraft’s survivability in even high-intensity conflicts,” said HENSOLDT CEO Thomas Müller. “The fact that the radar will be produced by a European consortium led by HENSOLDT, with Indra operating as main partner, shows that there is good cooperation in Europe on joint armament programmes.”

The new radar is based on state-of-the-art AESA (Active Electronically Scanned Array) technology. In contrast to conventional systems with a purely mechanically rotating antenna, the radar beam is electronically controlled by a multitude of individual transmit/receive modules. This principle in combination with a highly sophisticated multichannel receiver allows several tasks to be performed at the same time, and no longer one after the other like previously, e.g. tracking individual targets while scanning a wide expanse of the airspace in front of the aircraft.

HENSOLDT was already involved in the development and production of the sensor systems currently used in Eurofighter aircraft. At present, the company has a workforce of 2,500 people at its main production site in Ulm and is planning to hire 300 new employees for the HENSOLDT Group this year. The sensor specialist is investing 30 million euros in the construction of a radio frequency technology development centre in Ulm, among other things. In addition to electronic components for the new Eurofighter radar, AI-based sensors for a wide range of applications will also be developed there.

SENSOR+TEST Digital 2021 is at the ready

Preparations for Digital SENSOR+TEST, taking place from 4 to 6 May 2021, are running at full speed. More than 160 exhibitors are to present their latest achievements in sensor and measuring technologies during and after the trade fair. The participants can expect a comprehensive presentation program with exciting and in-depth technical talks.

“We’re on the home stretch and looking forward to the Digital Innovation Dialog among exhibitors and participants which is being offered again this year in all its facets by the SENSOR+TEST. Even if we don’t reach the size of previous presence events, we’ll still have over 160 exhibitors, who’ll have plenty of solutions among wide-ranging applications to offer the public,” says organiser Holger Bödeker.

The exhibitors are showing a plethora of innovative developments this year – and not just in text and images, but also in numerous video presentations with direct contact to the speakers per chat or video conference. Visitors can link up with experts per apps or internet portals, taking advantage of their consulting competence.

A variety of novelties can already be regarded. Thus, there are already more than 250 new developments on the SENSOR+TEST website  (https://www.sensor-test.de/direct/productnews) – and every day there are more. So it is worth it to take a good look – during and after the fair.

Comprehensive Action Program

As expected from the SENSOR+TEST, visitors will find a comprehensive action program even in this digital edition. In the lecture forum, exhibitors are to present new developments, products, and applications on all three days of the fair. Even this year’s special topic, “Sensor and Measuring Technology for Condition Monitoring,” and the digital community stand, “Young Innovative Enterprises,” will not come up short. “Whether it’s about the special topic, presentations, the AMA Innovation Award, or the parallel SMSI, the Sensor and Measurement Science International Conference: The participants expect information and inspiration from all sides and in-depth,” says Holger Bödeker.

Entrance Vouchers Available Now

As of now, visitors can obtain a free entrance voucher. Registration takes place at www.sensor-test.com/voucher. “We’re cordially inviting all interested parties to the digital edition of the SENSOR+TEST 2021. Be sure to register and get into the Innovation Dialog with the experts. Follow all the activities of the exhibitors and lecturers in our internet portals, per newsletter, or in the social-media channels. Though even if you can’t touch the technology on site this year, I’m certain that all participants will obtain all the important information necessary for their projects and also make new valuable contacts,” says Holger Bödeker.

STMicroelectronics joins mioty Alliance extending opportunities for massive IoT applications

STMicroelectronics is inspiring next-generation Massive IoT applications, which are driven by scale rather than speed, through support for the mioty standard, which enables highly scalable, long-range, and extremely low-power wireless connections.

Joining the mioty Alliance, which maintains the specifications and promotes the technology, ST has announced availability of a protocol stack from ST Authorized Partner Stackforce that allows customers to create mioty devices using the STM32WL wireless System-on-Chip (SoC).

“mioty promises to make exciting new Massive IoT applications possible, for instance, to cover a large geographical area,” said Hakim Jaafar, STM32 Wireless Marketing Director, STMicroelectronics. “The mioty stack further strengthens the ecosystem around our STM32WL SoC, which supports various common sub-GHz LPWAN technologies such as LoRaWAN, Sigfox, and wM-Bus, and delivers a unique level of integration that saves space, power, and time to market.”

mioty sends messages using an advanced telegram-splitting technique, which is recognised and standardised by the European Telecommunication Standards Institute (ETSI). This ensures extremely short radio transmissions that allow extended operation without the logistical challenges of replacing batteries in massive IoT networks. Short transmissions also minimise interference with nearby signals and allow many thousands of mioty nodes to coexist on the same network.

mioty data packets can travel several kilometers in built-up areas and more than 15km with line of sight, allowing just a few base stations to cover large industrial sites or outdoor areas such as oilfields. In addition, mioty devices can communicate while moving at up to 120km/h without signal-fading issues, serving applications such as fleet management, asset tracking, and theft detection.

The mioty protocol stack for the STM32WL has been developed by Stackforce, a founding member of the mioty Alliance and ST Authorized Partner. The stack is available as a library for direct application integration or firmware, ready to be flashed directly onto the SoC for modem-like use.

“The STM32WL has already proved to be a very powerful platform, especially regarding support for multi-protocol stacks. We’re thrilled to add mioty, a promising new LPWAN technology, to the interesting portfolio of (multi-)protocol stacks for STM32WL,” said David Rahusen, Managing Director, Stackforce.

The STM32WL is included in ST’s 10-year longevity program, which guarantees long-term availability to support developers of industrial products. For more information please go to www.st.com/stm32wl

HENSOLDT joins UN Global Compact

Sensor solution provider HENSOLDT is now a member of the United Nations Global Compact. The company is thus committed to the ten universal sustainability principles in the areas of human rights, labour, the environment and anti-corruption. By signing the Global Compact, HENSOLDT is making visible how important sustainable business practices are for the company. It is the world’s largest initiative for sustainable and responsible corporate governance.

As part of a group-wide sustainability initiative, the company has set itself numerous goals. Among other things, emissions are to be further reduced and the proportion of women within the workforce increased. “By joining, we want to show social and ecological responsibility,” says Thomas Müller, CEO of HENSOLDT AG. “For many customers and business partners, membership in the Global Compact has now become a kind of seal of quality,” Müller continues. By joining, the company is setting an example of corporate governance with integrity.

The Global Compact was launched in 2000 on the initiative of the then UN Secretary General Kofi Annan. Currently, around 15,000 companies and organisations from civil society, politics and science in more than 160 countries are part of it. HENSOLDT is proud to be a member of this high-level initiative of the United Nations.

HENSOLDT takes its responsibility as a global citizen and local company very seriously and has committed itself to performing sustainable pioneering work in the area of technology and human potential that supports the conservation of all species worldwide. At the same time, its activities serve the higher purpose of ensuring the freedom and future of our planet, our natural world and our lives. For this reason, also, HENSOLDT supports numerous initiatives that target sustainable investment in local communities, education, employees and the environment.

Silicon Designs announces immediate availability of complete aerospace testing portfolio

Silicon Designs, Inc., a leading designer and manufacturer of highly rugged commercial- and inertial-grade MEMS capacitive accelerometer chips and modules for zero-to-medium frequency instrumentation applications, today announced the immediate availability of its complete product portfolio for aerospace testing, including inertial navigation systems.

As both a 100% veteran-owned small business and an entirely U.S.-based manufacturer, Silicon Designs has supported both government and private-business aerospace programs since 1983. The company was founded, in large part, thanks to R&D funding it was awarded under a U.S. Small Business Administration Small Business Innovation and Research (SBIR) grant. With it, Silicon Designs began immediately designing, developing, and manufacturing custom MEMS capacitive accelerometers with integral amplification for the U.S. Navy. Today, the company continues to faithfully supply the military and aerospace sectors with cost-effective, high-performance standard and custom MEMS capacitive accelerometers for surface mount and wired implementations.

For inertial guidance, navigation, and control (GN&C) applications, including UAVs, Unmanned Ground Vehicles (UGV), Remotely Operated Vehicles (ROV) and Robotic Control systems, as well as photography and weather drones, the low-cost Silicon Designs Model 1525 Surface Mount Accelerometer Series is recommended. Offering industry best-in-class low-noise performance, the miniature, nitrogen damped, hermetically sealed Model 1525 combines both a MEMS capacitive sense element and a custom integrated circuit, the latter of which includes both a sense amplifier and ±4.0V differential output stage. These combined features make the Model 1525 Series ideal for GN&C zero-to-medium frequency instrumentation applications requiring high-repeatability, low noise, and maximum stability. Units are available in five full-scale ranges, from ±2 g to ±50 g, reliably operating over standard temperatures from -40°C to +85°C. Series units are relatively insensitive to wide temperature changes and gradients. A calibration test sheet is supplied with each unit, showing measured bias, scale factor, linearity, operating current, and frequency response characteristics.

For aircraft vibration monitoring, flight & flutter testing, and NVH testing, single axis Model 2220 and 2240 series MEMS capacitive accelerometer modules offer measurement stability, both AC and DC acceleration response, reliable high- and low-temperature operation, and low power consumption. These low-noise accelerometers are +8 to +32 VDC powered and offered with either a buffered ±4V differential output or 0.5V to 4.5V single ended output, along with an internal voltage regulator and reference. The Model 2220 series is housed in an anodised aluminium case, while the 2240 series features a hermetically sealed titanium case with a removable plug and cable. When ordered off-the-shelf in standard ranges of ±5 g, ±10 g, and ±25 g, these modules offer necessary DC response capabilities for low-frequency, high-precision aircraft flutter testing. The ±50 g, ±100 g, and ±200 g range modules further offer the necessary shock and vibration measurement capabilities for higher-impact landing gear monitoring and testing. Units within these specified ranges may be also used to support payload testing, as well as externally mounted accessories such as drop tanks, weapons, and radar antennae system enclosures (radome). They feature a simple four-wire connection and weigh as little as ten grams. Their low-impedance outputs can drive up to 2,000 feet of cable.

All Silicon Designs MEMS capacitive accelerometer modules and JCC/LCC chips are 100% in-house tested, programmed, calibrated, and verified within a climate chamber as to ensure their utmost measurement accuracy and reliability. Units are also fully calibrated and serialised for traceability prior to their shipment. Other aerospace applications supported by Silicon Designs include spacecraft and satellite testing; aircraft seat ejection testing; landing gear testing; Helicopter Attitude Heading and Reference Systems (AHRS); dynamic platform stabilisation; buffering, Health and Usage Monitoring Systems (HUMS); in-flight structural testing, aerospace component durability testing; systems performance testing; modal analysis; and global regulatory compliance testing. For additional information, visit www.SiliconDesigns.com.

About Silicon Designs, Inc.

Silicon Designs was founded in 1983 with the goal of improving the accepted design standard for traditional MEMS capacitive accelerometers. At that time, industrial-grade accelerometers were bulky, fragile, and costly. The engineering team at Silicon Designs listened to the needs of customers who required more compact, sensitive, rugged, and reasonably priced accelerometer modules and chips, though which also offered higher performance. Resultant product lines were designed and built to surpass customer expectations. The company has grown steadily over the years, while its core competency remains accelerometers, with the core business philosophies of “make it better, stronger, smaller and less expensive” and “let the customer drive R&D” maintained to this day.

Author: Molly Bakewell Chamberlin, President/Sensors Industry Subject Matter Expert, Embassy Global, LLC

New Lateral Excitation Test Stand from MB Dynamics reduces experimental modal survey measurement errors

MB Dynamics, field-proven industry experts in the design, manufacture and supply of vibration test systems and equipment, has announced the global market introduction of its Lateral Excitation Test Stand.

The MB Dynamics Lateral Excitation Test Stand can be used to help reduce measurement errors which can arise during experimental modal surveys. It does so, by offering versatile modal exciter suspension and support, as well as by applying force to a test structure in one of two unique ways: either horizontally, into the side of a test structure; or, obliquely, beneath a test structure. The stand further allows exact modal exciter positioning, in either horizontal or vertical direction, while still accommodating a maximum suspended load of up to 60 kg.

Designed by 40-year global industry experts in experimental modal analysis, the stand offers seamless compatibility with MB Dynamics’ own industry best-selling MODAL 50A and MODAL 110 exciter systems, of which more than 1,300 remain successfully installed in the field. The main structural parts of the Lateral Excitation Test Stand are constructed of a lightweight, durable, and rugged aluminium, while its rubber-footed adjustable steel legs offer added stability.

The Lateral Excitation Test Stand may also be used in combination with tensioned piano wire or compression stingers to help reduce measurement errors arising from unmeasured transverse forces. This, given that tension-only stingers can be used to apply axial forces without the typical sideloads which can otherwise contaminate measured data. When a piano wire stinger is properly suspended via four supplied turnbuckles, it connects to a test item’s force sensor via the modal exciter’s through-hole and corresponding base, along with any required inertial masses. The piano wire stinger then wraps around a pulley. Any required static preload force is applied via a small hand winch, with a series of quarter-turn handles used to secure the lateral arm and pulley. A low gear-ratio hand crank facilitates easy vertical adjustments of the suspended stinger over a range of 305 mm to 1415 mm. Upon application of sufficient static preload forces, as to exceed dynamic force, the piano wire stinger is secured by tightening the Dumore Chuck within the exciter’s moving element. As the Lateral Excitation Test Stand allows the modal exciter to be set atop its lateral arm and rotated more precisely about its trunnion base, the MODAL 50A or MODAL 110 exciter system can therefore provide excitation at virtually any angle, with up to a 300 mm horizontal adjustment rate, and with exciter motion properly isolated from the test stand.

Typical applications for the MB Dynamics Lateral Excitation Test Stand include virtually any experimental modal survey application incorporating the company’s own MODAL 50A and MODAL 110 exciter systems. These include, though may not be limited to, aircraft and automotive testing, civil engineering, power generation, and test & measurement applications. For more information about the new Lateral Excitation Test Stand, or MODAL 50A and MODAL 110 exciter systems, please contact MB Dynamics at +1-216-292-5850, sales@mbdynamics.com, or visit www.mbdynamics.com

About MB Dynamics, Inc:

Founded in 1939, the Cleveland, Ohio-based MB Dynamics has long distinguished itself as a total solutions provider for vibration test requirements. The company applies its vast wealth of experience in vibration testing and instrumentation to offer a truly one-of-a-kind innovative approach to customer problem-solving in automotive, aerospace, industrial, laboratory R&D, civil engineering, modal and structural testing, general test and measurement, academia, and other sectors. All solutions offered by MB Dynamics are further accompanied by the necessary hardware and software to ensure seamless integration, along with the value-added benefits of full engineering support, offered by one of the industry’s most experienced engineering teams. This local expertise is made available to MB Dynamics customers in more than a dozen countries. Visit www.mbdynamics.com to learn more.

Author: Molly Bakewell Chamberlin, President / Sensors Industry Subject Matter Expert, Embassy Global, LLC

Yokogawa to undertake proof of concept test of 5G, Cloud, and AI for remote control of plant systems with NTT DOCOMO

Yokogawa has signed an agreement with NTT DOCOMO (DOCOMO) to jointly undertake a proof of concept test (PoC) for the remote control of a plant system by utilising 5th generation mobile communications (5G), the cloud, AI, and other technologies.

The PoC will involve the use of cloud-based Yokogawa AI for plant control and a 5G communication module mounted on a three tank level control system to remotely control the water level. This test aims to demonstrate the ease with which companies in the chemical, oil, and other process industries will be able to modify their existing systems to make use of cutting-edge 5G autonomous control devices with the latest cloud-based AI. With the goal of achieving autonomous control in plants in the future, Yokogawa will work together with DOCOMO to verify and optimise this technology.

Driven in part by the ongoing COVID-19 pandemic, there has been a dramatic increase in the need for the improvements in production safety and efficiency that can be achieved through autonomous plant control. In a survey of process industries that Yokogawa conducted last year, 64% of respondents said they anticipated that plants will have fully autonomous operations by 2030, and that autonomous control mechanisms using AI and other technologies and not requiring human intervention will become increasingly common. However, given the latency in communication that occurs between the cloud and device controllers when conventional wireless communication is used, there have been major technological challenges when it came to autonomous remote control of plant systems.

This PoC will examine whether the technical challenge of achieving low latency can be solved by using DOCOMO’s high-speed, large-capacity, low-latency 5G communications network, the DOCOMO Open Innovation Cloud, which offers multi-access edge computing (MEC) to achieve low-latency and meet other such requirements of the 5G era, as well as other cloud technologies. Yokogawa has already completed a trial of an autonomous control system based on its proprietary AI technology that successfully controlled the water level in a three tank level control system, a task that is generally acknowledged to be very difficult, and the technology that was used is considered within the industry to be among the most advanced of its type. In the PoC, by the end of March 2022, Yokogawa will work with DOCOMO to construct a demonstration environment for the cloud-based remote control of the water level in a three tank level control system using the AI, and undertake, among other things, comparison and evaluation of communication performance between LTE and 5G.

Based on its in-depth knowledge of plant control and operational technology, IT, and industry, Yokogawa is helping customers in a broad range of industries visualise issues that impact every area of their business activities, optimise their operations, and thereby create new value and sustain growth. Through this PoC, Yokogawa will work with DOCOMO to create new value and contribute to the development of not only process industries but all other industries as well.

Kenji Hasegawa, a Yokogawa vice president and head of Yokogawa Products Headquarters, commented, “Yokogawa has long played a leading role in the development of distributed control systems that control and monitor the operation of plant production facilities, and we have supported the growth of a wide range of industries. With a view towards a future in which industries adopt autonomous operations, we are now promoting IA2IA (Industrial Automation to Industrial Autonomy). Through the linking of 5G with the cloud, Yokogawa’s AI, and device controllers, we believe that we can make a great contribution in achieving plants whose systems can be remotely controlled and are fully capable of operating autonomously. Along with NTT DOCOMO, we will work to create further value for our customers.”

Woods Hole Oceanographic Institution and Analog Devices launch Ocean and Climate Innovation Accelerator

Woods Hole Oceanographic Institution (WHOI) and Analog Devices, Inc. (ADI) have launched the Ocean and Climate Innovation Accelerator (OCIA) consortium. ADI has committed $3 million over three years towards the consortium which will focus on advancing knowledge of the ocean’s critical role in combating climate change as well as developing new solutions at the intersection of oceans and climate.

“Carbon emissions feature as a centrepiece in global efforts to mitigate climate change.  Oceans are among our most important defence mechanisms against a warming planet – yet their ability to continue to play this critically important role is being threatened by the effects of climate change,” said Vincent Roche, CEO of Analog Devices. “Through the Ocean and Climate Innovation Accelerator, we are committed to engaging ADI’s engineers and technologies to advance knowledge of the oceans, in order to gain a better understanding of how oceans are impacted by climate change and to develop solutions to restore ocean health. By doing so, we hope to drive meaningful impact on the global fight against climate change.”

The OCIA consortium is designed to be a highly scalable collaboration leveraging the unique resources and capabilities of its partner organisations. Among its goals, the consortium will focus on the development of the “networked ocean” – placing sensors across oceanographic environments that will continuously monitor critical metrics related to ocean conditions with the aim of informing business and policy decision makers, enabling evidence-based stewardship of ocean health and driving more accurate climate and weather predictions with real-time data.

“On behalf of WHOI’s entire community of ocean scientists and engineers, we are incredibly excited about this collaboration,” said Dr. Peter de Menocal, president, and director of WHOI. “The formation of the OCIA consortium comes at a time when support for science and ocean research is at a critical juncture. We are building a research innovation ecosystem that will drive new understanding to tackle global challenges facing society. It provides a new, scalable model showing how corporations can engage deeply on the climate crisis.”

The consortium will be jointly led by WHOI, a world leader in the oceanographic research, technology, and education dedicated to understanding the ocean for the benefit of humanity, and ADI, a world leader in the design, manufacturing, and marketing of a broad portfolio of high-performance semiconductor solutions used in virtually all types of electronic equipment. Designed to act as an engine for continuous innovation and powered by some of the world’s leading minds and businesses, the OCIA consortium is open to participation by a wide range of leading organisations across business, academia and non-profits that recognise the inextricable links between ocean and climate and wish to have a positive impact on the global climate crisis.

The OCIA consortium will also establish a robust, multi-stage innovation ecosystem, building on WHOI’s existing strengths in education and research to drive solutions-thinking and allow scientists and engineers to focus on high-impact problems. This will include the launch of a new Climate Challenge Grant Program which will award seed-funding for smaller, competitively selected projects.

Initially, the OCIA will provide two types of awards:

  • Incubation Awards: comprised of seed-funding awarded to dynamic individuals and teams. Incubation Awards will support design, exploration, and early execution of new, cutting-edge scientific initiatives that foster new avenues of research and engineering and encourage and incentivise collaborative engagement.
  • Acceleration Awards: awarded to successful recipients of prior support for novel ideas and technologies, as well as other more mature projects, for the purpose of expanding these programmes, increasing public engagement, and positioning and preparing projects to achieve lasting impact and receive durable outside support.

As the consortium grows over time, OCIA programmes may expand to invest in people through the establishment of fellowships and other awards, along with a portfolio of other activities such as support for collaboration hubs to drive innovations in data processing, machine learning, and transdisciplinary science and engineering.

“Now more than ever, it is essential for people to understand that the ocean and climate are not two separate systems, but rather part of a single system that spans our entire ocean planet and affects the lives of people everywhere, even if they live far from the coast,” said de Menocal. “Recognising this, it is critical for organisations like ADI and WHOI to find common cause and work in shared-mission partnerships to help mitigate the rapidly advancing threats brought on by a warming planet.”

Full steam ahead for training at Tetra Pak

In the food and drinks industry, steam is used extensively for heating and sterilisation processes. It is important that all those involved in the specification and operation of steam systems have a good understanding of control features and maintenance. Tetra Pak Processing UK Ltd., has taken advantage of Bürkert Fluid Control Systems’ steam training sessions, which are held regularly at the company’s headquarters in Cirencester, UK.

The correct design and installation of a steam system ensures safe, efficient and reliable operation. Understanding the principles that affect the performance of a steam system is very important in the food and beverage industry and also one of the reasons why Tetra Pak Processing UK has chosen to send its staff on a training course.

Alex Duckworth, Service Account Manager at Tetra Pak Processing UK, explained: “The global relationship between Bürkert and Tetra Pak meant that we already knew before attending the training that it would be a beneficial experience. We wanted to increase our knowledge and understanding of the Bürkert technology used in the control of steam processes and this course did exactly that.”

Alex concluded: “The trainers were highly professional throughout the course and engaged with all the participants. The increase in knowledge from attending will definitely benefit not only my colleagues and I, but also our end customers.”

Kirsty Anderson, Marketing Manager at Bürkert UK, added: “We are passionate about sharing knowledge and our training programmes are designed to deliver the greatest benefit and education to those who attend. Our training is based firmly on the knowledge and experience we exercise on a daily basis. The course structure is well established and it is delivered in a comfortable and professional manner.”

J2 Innovations releases Project Haystack 4 open-source library

J2 Innovations, a Siemens Company and a founding member of Project Haystack, today announced the release of Haystack Core, an open-source software library for the latest Haystack 4 open standard which can be used by developers to create new smart building and IoT applications.  Written in TypeScript, the open-source initiative will enable more sophisticated applications to be built with ease and at speed.  Haystack Core paves the way for a host of new solutions that can manage energy usage, reduce carbon emissions and leverage the latest technologies. By using the Haystack Core APIs  J2 Innovations’ OEM and ecosystem partners will be able to  create their own Haystack based devices more easily, and faster.

Now in its tenth year since inception, Project Haystack is an open-source initiative that streamlines the way data from the Internet of Things is handled to solve interoperability issues between devices and equipment.  With an emphasis on standardising semantic data models, and using web services, its mission is to unlock the value from the vast quantity of data being generated by the smart devices that permeate our homes, buildings, factories and cities.  Applications have been developed for automation, control, energy, HVAC, lighting and other environmental systems.

Today Project Haystack encompasses the entire value chain of building systems and related intelligent devices.  Founding member companies include Siemens, ConserveIT, J2 Innovations, SkyFoundry, Legrand, and Lynxspring.  Associate members include many other building-related suppliers and service providers of all types.  Novel and innovative ways to apply Haystack are constantly evolving.  J2 Innovations has recently contributed Haystack JSON, a new JSON encoding format that aims to improve upon the existing encoding format by making Haystack data more accessible for developers.

“It’s significant that we’re able to announce this just before Haystack Connect 2021.  The initiative has the potential to take Haystack to a different level of sophistication in the smart buildings and IoT applications world and beyond,” said Gareth Johnson, Senior Cloud Architect, and creator of the library, at J2 Innovations.  “This is the first library written in TypeScript that fully supports Haystack 4.”

“Haystack has always been about being an open, productive, and powerful development environment and we think this will inspire the community to innovate and build leading-edge software applications that will tap into the vast potential of the eco-system.  And the more interesting apps being created will mean the more powerful and pervasive Haystack will become in our lives.”

John Petze, Executive Director of Project-Haystack.org said: “This substantial addition to the library of Haystack tools and software applications demonstrates the continued efforts of the community to advance and streamline the use of smart device data. J2 Innovations has been part of the Haystack journey since the founding of the effort in 2011. We are excited to see this major contribution!”

The Haystack Core libraries provide a suite of powerful APIs that make it easy for working with Haystack data. This includes an implementation of the Haystack data model, filter compilation, unit database, Zinc, Trio and JSON support, client network support with automatic watch management and specialised Haystack React hooks.

The open-source code can be downloaded from GitHub, the largest and most advanced development platform in the world: https://github.com/j2inn/haystack-core

Jason Briggs, CTO, J2 Innovations, and Gareth Johnson, Senior Cloud Architect, J2 Innovations will unveil and deliver a presentation on Haystack Core at Haystack Connect 2021 on May 4 2021 at 14:00 EST. Gareth will also deliver a session on the new Haystack JSON encoding (a.k.a Hayson) just after on 4 May at 14:30 EST.  The presentation will cover utilisation with JSON and OpenAPI schema to create robust Haystack-enabled REST APIs and more.

Haystack Connect 2021 is organised and produced by the Project Haystack Organisation—an open-source community of people and companies who share the vision that a connected, collaborative community can move the industry forward in ways that no single supplier can.  The event builds on the inspiration and mission of the community to address the challenges of making smart device data work seamlessly across applications of all types through the adoption of a standard approach to semantic modelling of equipment systems and their data.