News

ADLINK Application-ready IIoT Gateway Presents Strong End-to-end Connectivity with Ease

ADLINK Technology Inc., a global leader in edge computing, is proud to launch its latest innovation, the EMU-200 series, an application-ready IIoT gateway that can easily meet the data network requirements of various harsh application scenarios, including renewable energy, electric vehicle (EV) charging, building management, and factory equipment monitoring.

To facilitate rapid deployment in diverse application environments, the EMU-200 series features a built-in smart software tool, the EGiFlow web console, which allows for seamless integration of multiple communication protocols. Paired with extensive connectivity options and highly adaptable hardware specifications, EGiFlow can cater to a wide range of on-site configurations while reducing the efforts required by engineers on development and deployment.

Integrating EGiFlow with the EMU-200 series simplifies the once complicated data transfer process between different systems and provides pre-configured data flow settings, alleviating the workload of solution developers and expediting the setup process for data collection, transferring and filtering from multiple sources, all achievable through a straightforward three-step setup.

To achieve broad connection coverage, the EMU-200 series integrates a variety of mainstream industrial communication protocols, such as Modbus TCP/RTU, MQTT, and OPC UA. Additionally, open charging point protocols (OCPP) for electric vehicle charging will soon be integrated. This comprehensive protocol support ensures data transmission compatibility, while avoiding issues caused a by lack of supported protocols. Furthermore, the EMU-200 series supports abundant I/O interfaces, along with Wi-Fi, 4G/LTE connectivity. This enables connection to data acquisition device such as remote IO and Ethernet DAQ systems, facilitating seamless connectivity from the edge to cloud platforms.

The EMU-200 series uses an ARM Cortex-A9 processor, known for its excellent power efficiency and suitability for operating under power supply restrictions. Its compact dimensions, coupled with multiple mounting options, and an impressive operating temperature range of -20 to 70°C, ensure adaptability even in harsh environmental conditions.

“Apart from the application-ready functions, the EMU-200 series is ideal for second development to fulfill a variety of applications from platform to integrated solutions,” said Jeremy Wu, Director of the Open Instrument Business Product Center.

To learn more about this innovative product line and how it can enhance your field site connectivity, please visit the link or contact our sales team for more details.

Unlock Peak Automation Efficiency with Mencom at Automate 2024

Experience a new level of industrial connector excellence at the Mencom Corporation booth #4084 at Automate 2024, May 6–9 in Chicago, Illinois, USA.

The booth features hands-on demonstrations of the latest industrial electrical connectors, including power, control, signal, and network connectors.  These products are designed to provide robust performance even in harsh environments, ensuring reliable connectivity, and withstanding the most demanding applications.

Mencom’s team of connector experts will be available to provide personalized consultations, assisting you in finding the perfect solutions to integrate secure and dependable connections into your diverse equipment and applications.

Don’t miss out on this opportunity to witness firsthand the difference that Mencom can make! Stop by booth #4084 at Automate 2024 and see how their innovative solutions can help your business streamline and succeed.

ABOUT AUTOMATE

Automate is a trade Show and Conference produced by the Association for Advancing Automation (A3). It is proud to be the largest solutions-based showcase of automation, robotics, vision, motion control and other automation technologies in North America. www.automateshow.com

Baty Venture FV: Bowers Group Unveils New Field of View Series at MACH 2024

Bowers Group has proudly unveiled its new Baty Venture FV Series at the 2024 MACH exhibition, introducing the latest in its range of innovative vision systems to coincide with the opening of the show.

The exciting product launch has provided visitors with the exclusive opportunity to be the amongst the first to experience live demonstrations of this exciting new field of view product from the world-renowned Baty brand.

“We are thrilled to introduce the Baty Venture FV at MACH 2024,” said Martin Hawkins, Managing Director at Bowers Group. “This impressive field of view machine represents a significant advancement in our product line, providing remarkable levels of efficiency and versatility to our customers. Bringing with it a wealth of user-friendly features and industry-leading innovation, the launch of the new Venture FV marks the start of a series of new products across our product range in the coming months. We really do encourage visitors to head over to our stand to find out more.”

The Baty Venture FV sets a new standard in Bowers Group’s precision measurement offering, providing advanced features and high-speed measurement. Equipped with auto part recognition and a powerful camera, coupled with telecentric LED lighting, the vision system delivers precise field of view measurements with exceptional clarity. Its intuitive software streamlines the measurement process, allowing for seamless operation and efficient data analysis.

The new FV series is being displayed throughout MACH exhibition, allowing visitors to explore the features of the machines in real time, with a team of experts on-hand to deliver live demonstrations and discuss the benefits both the Venture FV, and the wider Baty vision range, could bring to businesses throughout many industries.  

For full details of the Baty Venture FV and Bowers Group’s wider range of connected metrology solutions, visit the team at stand 19-440, located in the measurement & inspection zone of MACH 2024. Or visit www.bowersgroup.co.uk for more information.  

MVTec opens its first subsidiary in Taiwan

MVTec Software, a leading international software manufacturer for machine vision, is strengthening its activities in Taiwan and establishing its own subsidiary in Hsinchu, southwest of Taipei. The new subsidiary was opened on April 1, 2024, and is intended to further intensify the exchange with customers from Taiwan. Martin Krumey, Vice President Sales at MVTec, explains the background: “Our goal at MVTec is to be close to our customers worldwide. Taiwan is a strategically important market for us. We believe that with our increased local presence, together with our local partners, we can understand and serve the needs and requirements of our customers even better.” MVTec has already had a sales office in Taiwan since 2020. This will now be relocated from its previous location in Taichung to Hsinchu and upscaled into a subsidiary.

Expansion of presence for greater customer proximity

In terms of personnel, MVTec is focusing on continuity in Taiwan. Jash Chu and Edward Tsai, who were already working in the sales office in Taichung, are the first two employees of the new subsidiary MVTec Taiwan Co., LTD. The expertise of the sales office employees will help MVTec to further expand its presence on the Taiwanese market and intensify its proximity to local customers. Jash Chu, Technical Sales Manager, explains: “Our powerful software products HALCON and MERLIC are already well known in the market. With the new subsidiary, we are now able to provide customers with even faster and more comprehensive support for their specific, often very complex inquiries. This service directly from us as the manufacturer helps to get even more performance out of the machine vision applications.” Edward Tsai, Sales Manager, adds: “We have been working with strong local partners, such as sales partners or hardware manufacturers, for years. We want to maintain these partnerships and expand them accordingly for the benefit of our customers.” To achieve these goals, the number of employees in the new subsidiary will be increased further over the next few years.

Enormous potential in the semiconductor industry

“Our focus sector in Taiwan clearly is the semiconductor industry. Automation and the corresponding use of machine vision, including our software, are already very advanced here. Nevertheless, the market is growing very dynamically. We decided to open the subsidiary to meet the increasing technical challenges in particular,” says Martin Krumey. 

MVTec Software GmbH was founded in Munich in 1996. The MVTec software products HALCON, MERLIC, and the Deep Learning Tool are developed at the Munich headquarters. By using modern technologies such as 3D vision, deep learning, and embedded vision, MVTec software enables new automation solutions as well as their use in demanding sectors such as the semiconductor industry, battery production, or electronics industry.

Elevating Textile Testing with James Heal’s HydroView and AirPro

 

Introduction to James Heal

James Heal stands as a global leader in the provision of advanced textile testing instruments and consumables. Renowned for its innovation and precision, James Heal’s expertise is trusted by top brands, retailers, manufacturers, and laboratories in over 70 countries. With products crafted by testing experts for testing experts, James Heal continues to lead the way in testing innovation.

About FORTEC UK

At FORTEC United Kingdom, their mission is to be the premier provider of complex, innovative, and expert solutions in industrial electronics. A team of technology specialists collaborates closely with their clients to tackle intricate technical challenges through advanced displays, embedded computing, monitors, components, and power solutions. Empowering their customers to look beyond the initial specifications to adopt solutions that are more effective, efficient, or sustainable. Embracing complexity sets them apart and defines their unique approach.

James Heal’s Partnership with FORTEC UK on HydroView and AirPro

When James Heal sought an expert to collaborate on their new HydroView and AirPro instruments, they turned to FORTEC UK for their expertise in advanced display solutions, aiming to bring the latest technology for functionality and user experience.

Revolutionising Textile Testing with HydroView

The HydroView Hydrostatic Head Tester is James Heal’s answer to the textile industry’s need for materials that perform exceptionally under various conditions while meeting high aesthetic and functional standards. Designed to assess the water resistance of a broad spectrum of fabrics, the HydroView is synonymous with precision, reliability, and an unparalleled user experience.

FORTEC’s recommendation for the new HydroView

  • Litemax 10.1” High Resolution, IPS, High Brightness, Industrial Display with Multitouch Projective Capacitive Touch Screen: This display provides sharp, clear visuals and wide viewing angles, crucial for precise test result analysis. Its high brightness and robustness are ideal for diverse testing environments, while the Multitouch functionality offers an intuitive testing experience.
  • Customer Branded Protection Glass with Optical Bonding: This feature not only boosts brand visibility but also ensures the display’s durability and clarity. Optical bonding technology enhances readability in various lighting conditions and fortifies the screen against environmental challenges.
  • Custom HDMI Board with Audio and Configured Cable Sets: This setup ensures flawless device connectivity and integration, vital for contemporary testing laboratories. The inclusion of audio and bespoke cable sets enhances reliability and simplifies assembly, facilitating smooth operation.

Introducing AirPro: The Air Permeability Tester

In line with the HydroView, the AirPro by James Heal demonstrates the company’s dedication to innovation in textile testing. This highly accurate air permeability tester is suitable for a range of materials and comes equipped with Test Wise software, offering an intuitive and user-friendly interface for diverse testing applications.

FORTEC’s Custom Solutions for AirPro

  • Litemax 7.0” High Resolution, IPS, High Brightness, Industrial Display with Multitouch Projective Capacitive Touch Screen: Guarantees optimal visibility and durability, complemented by intuitive touch controls for an efficient testing process.
  • Customer Branded Protection Glass with Optical Bonding: Delivers a bespoke, premium appearance while enhancing the display’s durability and clarity, essential for accurate testing outcomes.
  • Custom HDMI Board with Audio and Configured Cable Sets: Promotes seamless operation and connectivity, with audio for an interactive testing experience and custom cables for enhanced reliability.

The partnership between James Heal and FORTEC UK in the development of the HydroView and AirPro underscores the powerful synergy between cutting-edge technology and textile testing expertise. These advancements not only meet the industry’s demand for precise and dependable fabric testing but also establish new benchmarks for the design and functionality of textile testing instruments. As the textile sector progresses, the importance of such innovations becomes increasingly critical, ensuring that manufacturers can fulfil the growing expectations for high-quality, durable, and functional textiles.

To view the AirPro from James Heal click here and to view the HydroView click here

To find out more about FORTEC UK and their offerings for Instrumentation please click here

Raising the bar for tomorrow’s standards

The markets are changing, and thus so are the requirements of the process manufacturing industry. Whether it is fluctuating demand, more customised products or smaller batches, manufacturers need to respond more quickly and flexibly. Here, Bradley McEwan, business development manager at automation and control technology specialist Beckhoff UK, discusses how software and modular hardware enables easy integration of technologies, like robotics and vision, that were once considered ‘standalone’.

Flexible manufacturing is a modern approach that emphasises adaptability, responsiveness and customisation in the production process. Unlike traditional mass production, where the focus is on producing large quantities of identical products, flexible manufacturing systems can efficiently handle small to medium-sized production runs and easily adapt to changes in product design or customer requirements.

Enabling manufacturers to quickly switch between different products without incurring significant downtime or retooling costs, the move towards flexible manufacturing happened before the destruction of the supply chain, pandemic and global wars. In fact, a major driving force behind the move was because of short run times and manufacturers wanting to test the market with products, owing to end users promoting seasonal events, such as Easter and Christmas.

Machine life cycles

Typical commercial products, such as shampoo, used to have a life cycle of between three and five years. Therefore, it was financially viable for manufacturers to buy machinery solely for a single product that has a long-life cycle.

Now, we are now seeing a significant decrease in the life cycle of commercial products, which is paving the way for flexible manufacturing. Manufacturers are no longer tied to a product line for the same amount of time, instead they require a production line that consists of at least two or three products.  

The advent of Industry 4.0 kickstarted the need for machines to become smart integrating into the ‘cloud’ for data analysis to enable seamless reconfiguration. As a result, this changed how manufacturing companies evaluated the capital investment of machines, as the emphasis switched from being on the life cycle of the product, to the life cycle of a machine.

After all, it is not financially viable to buy new machinery every 18 months. Not only it is a significant upfront cost, but it also takes around two years to get the machine sealed and delivered ready for use.  

Variable product flow  

Traditionally, a production line would have a continuous flow of product, often referred to as a continuous production process or continuous flow manufacturing. This approach is characterised by the steady and uninterrupted movement of products along the production line, with each station performing a specific operation in a sequential manner.

Yet, the introduction of flexible track systems is enabling production lines to have a variable flow of product. Flexible track systems consist of modular units that can be easily connected or rearranged to form different production lines or workstations, ensuring quick reconfiguration to accommodate various product types or changes in production requirements.

These systems, such as Beckhoff’s TwinCAT software platform, combine the advantages of flexible manufacturing with the efficiency of continuous production, achieving greater adaptability and responsiveness to changing demands while maintaining high throughput and efficiency.

Laying down the foundation for modular production, the TwinCAT software-based approach integrates Programmable Logic Controller (PLC), motion control, robotics, vision, Human-Machine Interface (HMI), cloud connectivity and other functionalities into a single software environment. And, as Industrial PCs (IPCs) increase in power, the TwinCAT platform allows for further integration.

By reducing the number of components, such software is designed to allow original equipment manufacturers (OEMs) to enable modular production and start their flexible manufacturing process.

In fact, we believe that PC based automation is a move away from the traditional fixed PLCs, enabling the easy integration of robotics, vision and machine learning applications that were once unimaginable.

For more information about Beckhoff’s TwinCAT and other modular automation software platforms, visit www.beckhoff.com

Custom ICs for enhanced high-precision metrology

Manufacturers who need high positional accuracy for their machinery rely on the accuracy of metrology technology. Here, Ross Turnbull, Director of Business Development and Product Engineering at ASIC design and supply company Swindon Silicon Systems, explains how custom Application Specific ICs (ASICs) offer enhanced precision for even the most demanding measurement applications.

Metrology instruments are a crucial element of the manufacturing plant. Whether for calibrating production machinery or for post-production verification, metrology equipment goes a long way in ensuring a high-quality finished product that meets specification. 

Coordinate measuring machines (CMMs) are an example of a metrology instrument, able to provide measurements in all three dimensions. In post-production quality processes, CMMs are used to measure the geometry of physical objects for any manufacturing flaws or errors. This is achieved with a scanning probe by measuring discrete points or lines across the object. Control of the probe angle is also possible, allowing the machinery to measure surfaces that would be otherwise unreachable.

Converting the motion of the scanning probe into useful positional information is possible with the use of encoders. Encoders combine a scale, similar to the markings on a conventional ruler, with a readhead describing motion relative to the values on the scale.

Exploring CMM circuitry

The encoder typically converts a physical stimulus into an analogue signal. For this signal to be understood and interpreted by digital devices, including the metrology software, this signal must first be digitised.

It’s possible to use a variety of off-the-shelf integrated circuits (ICs) to perform the necessary tasks of signal amplification and conversion. However, for an optimised solution, the roles of these individual ICs can be condensed into a single chip: an ASIC.

An ASIC is a chip that has been designed exactly for customer requirements. A complete custom design approach results in a high-performance IC with capabilities beyond those offered by standard off-the-shelf devices.

By taking a careful approach to design, it’s possible for an ASIC to encompass all the features of several standard ICs in one package. Consolidating functionality into a single package typically allows for a reduction in PCB size. A more compact size allows for a smaller and lighter encoder that can be easily designed into CMM equipment. 

ASIC design also facilitates greater performance where it matters. In a position sensor, this might be a non-linearity specification for improved sensor calibration and accuracy. This is where working with an experienced ASIC designer can be hugely advantageous; the entire signal path can be optimised for a chip that offers both the technical and commercial advantage to the customer.

In metrology, even a minute fraction of a millimetre could be the difference between product success and failure. As a result, it’s vital that metrology equipment and the sensors within are class-leading. With the help of ASICs, accuracy of these devices can be enhanced for improved product quality and efficiency.

MTF testing of military optics

Optical Surfaces Ltd has supplied two reflective beam collimators to a leading European supplier of high precision optics to military and defence contractors.

Reflective beam collimators are mirror assemblies that take divergent or convergent incoming light and produce parallel output. They can be used to replicate a target at infinity without parallax. Consequently, reflective beam collimators are the device of choice for performing Modulation Transfer Function (MTF) measurements over extended wavelength ranges.

Dr Aris Kouris, Sales Director of Optical Surfaces Ltd said “MTF is a technique, trusted by optical designers, for objectively evaluating the image-forming capability of military optical systems. We were chosen as a partner for this project because of our track record in supplying affordable, high performance beam collimators tailored to enable precise MTF testing of military optical systems”.

He added “The high stability and performance of our reflective beam collimators is achieved using a zero expansion off-axis parabolic mirror, manufactured to better than lambda/10 p-v surface accuracy. The all-reflecting design of our beam collimators is achromatic and with aluminium / magnesium fluoride coatings can operate from the UV to the infrared without adjustment. The optics within each beam collimator are secured using stress-free mounts and come pre-aligned for optimum performance. The off-axis design of our beam collimators produces no central obscuration thereby ensuring highly efficient transmission is obtained”.

Benefiting from a lightweight design and new assembly technique – Optical Surfaces beam collimators uniquely combine high stability, high performance, and short delivery time all at a market competitive price. For further information on reflective beam collimators tailored to your application please visit https://optisurf.com/reflective-collimators/ or contact Optical Surfaces Ltd. on +44-208-668-6126 / sales@optisurf.com.

Sondrel poised to support the evolution of intelligent cars with ultra-complex chips

According to Sondrel, a leading provider of ultra-complex chips, the designing of Software Defined Vehicles (SDVs) is changing the automotive ecosystem, including new methodologies and technology approaches that could significantly reduce costs and shorten time to market for advanced features.

According to a report by IDTechEx, Connected and Software-Defined Vehicles 2024-2034: Markets, Forecasts, Technologies, “Connected and Software-Defined vehicles (SDVs) represent a new paradigm for automakers and consumers. Whereas older ICE (Internal Combustion Engine) vehicles were a conglomeration of 70+ Electronic Control units, kilometres of wiring, and many thousands of components, the new era of vehicles can be more centralized, connected, and convenient, bringing benefits to both the consumer and OEM”.

“Differentiation has always been key for car manufacturers,” explained Oliver Jones, Sondrel’s VP Strategic Sales. “As software, electronics and connectivity become the dominant sources of innovation in cars, car manufacturers are each creating their own platforms of bespoke chips and software that can be scaled to suit all the various models of vehicle (SDV) in their range. Such a platform will provide cost savings from the huge economies of scale and prevent rivals from copying their innovations as significantly fewer off-the-shelf chips are used.

“We have a head start in being able to provide such bespoke platform solutions for customers as we already have our innovative, modular family of Architecting the Future design platforms with the SFA 250A and the SFA 350A that are specially designed for automotive use and ISO 26262 compliance, and have already been successfully used to fast track automotive projects. These powerful platforms were designed to support scalability based on requirements and to be configured with the processing capability and power depending on the end use case and the demands of the customer’s software.

“The challenge is that SDV chips will need several processors with billions of transistors to deliver the advanced processing performance to run all the functions such as infotainment, ADAS, vehicle sensing and connectivity. Our team works closely with customers at the architectural design stage to ensure that the right balance of power, performance and cost is achieved right from the start. We use the most advanced semiconductor nodes and our turnkey service can take projects all the way from initial architectural design through the exhaustive testing needed for automotive components to supplying chips. This turnkey service frees the Automotive OEMs from the risks of a multi-stage, multi-supplier, manufacturing chain that have become all too problematic over the past couple of years. By partnering with Sondrel, they can now own their chip destiny and, with our global footprint, we are ideally positioned to deliver it for customers around the world.”

Sondrel’s experience in automotive electronics has been developed from many chip projects that built up the company expertise in functional safety (FuSa), ISO 26262 and silicon-level security. The latter is particularly important for SDV cars as the 10- to 15-year lifetime of cars means that updates and patches will have to be implemented without exposing vulnerabilities to hackers so security needs to be integral to the chip design. This has to be right from the start when the chip is being specified and continued through all the stages of the chip design and on into the silicon production. Jones concluded, “We are one of the few companies with the experience and expertise to design such ultra-complex chip projects that fully integrate hardware and software and will be the enablers of SDVs.”

More on Sondrel’s innovative Architecting the Future IP platforms here.

Farnell expands range of high-quality passive components to support customers in their design journey

Farnell has announced that is has substantially expanded its already extensive range of passive component stock with the addition of new arrivals from brand names such as YAGEO, Kemet, Murata, Wurth Electronik and Panasonic.

The passive component market is expected to continue expanding in the coming years. The rising popularity of consumer electronics, automotive electronics, and industrial automation results in more passive components being required in all applications. Farnell is committed to stocking a broad range of passives from market-leading suppliers to ensure that critical projects ranging from robotics and IoT to EVs, 5G, and medical devices, can proceed without any delays.

Juergen Ruben, Director Sales DACH & Eastern Europe at Farnell, said, “Farnell is well aware of the ever-evolving market demands and the need to stay ahead of the curve. With the growing number of applications requiring passive components, such as IIOT, robotics, EV & charging, wearables, and beyond, Farnell is committed to being at the forefront of new product introductions and partnering with manufacturers from the point of designing new technologies. Our expanded product range and strong linecard position us well to meet the future demand for smaller and powerful components. We understand that the market can turn quickly, and we are ready to meet the challenge head-on with our expertise and commitment to excellent service.”

Highlights of the extensive Farnell range include Kemet’s KC-LINK™ with KONNEKT™ technology surface mount capacitors, R4Y series and C700 series capacitors; Yageo’s VT thin film resistor series; Wurth’s SMT power inductors; Murata’s lead disc ceramic capacitor and, Panasonic’s ERJ-PM8 series anti-surge thick film resistors.

All of these high-quality components are now available from Farnell, with the added benefits of fast delivery; a variety of packaging options including full reel and re-reel; and full compliance with automotive, aerospace and military industry standards coupled with full product traceability to ensure customers receive uncompromised service.

Simon Leuz, Team Lead Distribution EMEA, Wurth Elektronik said, “Customers and service providers still have substantial stock in their warehouses. Nevertheless, Würth Elektronik has been investing in its supply chain and stock to enable growth. A strong supply chain, good availability and great partnerships will be significant to service customers when the market picks up again. We´re seeing this as a challenge as well as an opportunity. We expect the second half of 2024 to be brighter and better.”

A spokesperson for Murata said: “In terms of stock availability and prices the company is planning to produce generally in line with sales, or to build up inventory. Prices are declining, especially for consumer product parts for smartphones and PCs. The outlook is that in addition to continued price competition in the consumer market, there will be periodic price revisions for automobiles, so Murata expects prices to continue to decline in that sector as well, especially in the EV market. However, the speed of EV body price reductions is expected to subside by the end of 2024. 

“At present, there are several persistent issues impacting global supply chains: some inherent like the scale and complexity of modern components, and some are external, like supply chain and manufacturing disruptions caused by weather events, trade restrictions, and global instability,” the spokesperson added. “But there is still widespread innovation and opportunity across the electronics industry. The demand for electronic components will continue to be driven by the emergence of new and exciting technologies like AI, as well as the continuous push for increased digitisation and intelligence across industrial, automotive, and medical sectors.”

YAGEO Group’s Director Global Distribution EMEA, Thomas Heel added, “The YAGEO Group is well positioned to secure the supply of high-quality products for tomorrow´s designs. We see a huge interest from design engineers for our new technologies especially in the e-Mobility, Green Energy and Industrial Automation markets.

“We are convinced that the electronic content will continue to increase in the coming years, and that the demand for high grade electronics components will strengthen. It will allow engineers and innovators to make the impossible possible.”

The complete range of passive components can be ordered online from Farnell in EMEA, element14 in APAC and Newark in North America.