News

Parker Hannifin has announced the launch of the new SensoControl SCP04 pressure sensor for hydrogen applications.

With this latest development, Parker is following its strategy of engineering products for new markets and future applications. Hydrogen is more and more frequently used in all kinds of transportation equipment: from trucks to buses to trains and marine. In order to enable the production, transportation, fuelling and storage of hydrogen, new products and solutions are necessary. The SCP04 pressure sensor from Parker has been designed to meet the chemical and physical requirements in the whole hydrogen lifecycle. Here the sensor is especially flexible due to its different threads to match a wide range of system connectors.

The SCP04 offers a high-pressure resistance and, as a digitally calibrated piezoresistive measuring cell, it detects pressures from 4 bar up to 1,000 bar. The special-bonded connection withstands low temperatures, shocks or vibrations, which makes it especially robust for the most demanding environments.

A monolithic design removes the need for internal seals and eliminates leakage due to material fatigue. The SCP04 has no pressure transfer fluid and no large, pressurized areas. It is also vacuum-tight and elastomer-free. The process connections have been designed to be gasket-free to meet the requirements of hydrogen applications.

The SCP04’s robust construction from 316L stainless-steel and low permeability result in a wide media resistance and prevent embrittlement of the metal by ionized hydrogen. Besides that, the sensor offers a high connectivity through high compatibility with different available connectors and can be configured with various output signals.

For more information, please visit: https://ph.parker.com/gb/en/pressure-transmitter-scp04

The demanding quality standards of the automotive industry require a manufacturer to inspect the control knobs they manufacture for in-car audio systems, before shipment to the car assembly plants. The presence of a small metal washer that can occasionally become dislodged from inside each knob is therefore checked using a custom-built testing machine.

An array of Contrinex extended-distance ‘500’ Series inductive sensors are positioned directly below a tray of 70 knobs, to confirm the presence of a washer in each radio button, enabling fast and reliable testing.

Application

During manufacture, a spring-washer is fitted to each knob after it has been moulded, and it is this washer which holds the control knob onto the in-car audio system. The manufacturer transports batches of knobs to automotive assembly plants in plastic transit trays which each contain 70 knobs. Occasionally, washers are omitted or become dislodged, resulting in the rejection of entire batches of the knobs by the automotive plant and potential penalties.

Manual inspection of each knob is neither practical nor cost-effective, so a sensor system was required that could test each knob in-situ within the transit trays used to deliver the knobs to the customer.

The small size and position of the washers make the task particularly demanding. There is only a small amount of metal present in each of the 10mm-diameter washers, as they are formed from 1mm-diameter steel wire. The washers lie more than 10 millimetres above the bottom of the plastic tray which is the only feasible sensor location. The transit trays tightly pack the knobs together at 45mm centres, and so the inductive sensors must reliably check the presence of the washers through the plastic tray, without interference from the other nearby sensors.

Solution

Contrinex Extended Distance ‘500 Series’ inductive sensors, available from PLUS Automation, are ideal for this application with the M18-diameter units operating reliably at sensing distances up to 12mm. The quasi-embeddable sensors feature chrome-plated brass bodies and PBTP sensing faces. They allow a minimum clearance between sensors of only 44mm, achieving the 45mm between centres requirement of the existing transit trays.

A bank of 70 sensors, mounted in a custom-built testing fixture, aligns exactly with the positions of the knobs in the transit tray. Locating lugs position the tray correctly and clamps secure it during the testing cycle. The presence of a washer in each of the 70 knobs is accomplished in a few seconds and in the event that a washer is missing, the position of the faulty knob is immediately identified.

This Contrinex inductive sensor has an industry-standard PNP normally-open interface and an integral M12 connector, which allows the easy removal and replacement of individual sensors for maintenance.

Conventional measurement and testing solutions designed for the EV market rely on inefficient stacks of single-purpose devices, consuming more space and power at higher cost points. Modern approaches based on ADLINK PXI products can consolidate the functionality of these stacked solutions into far less space, thereby lowering energy use and cost while simultaneously scaling potential application loads due to the flexibility and scalability of ADLINK’s high-performance PXI design platform solutions.

Electric vehicle (EV) manufacturers and those that service them operate in one of today’s most rapidly evolving fields. As such, the testing and measurement processes and equipment for the EV industry often need to evolve at a similar pace. Traditional instrument approaches tend to be fixed. They provide a single set of functionalities in a set way, and if needs around those instruments change, the equipment likely must be replaced. A modular, scalable testing solution with much higher function density could offer tremendous advantages in both the short- and long-term.

Since 1997, the PCI eXtensions for Instrumentation (PXI) standard for industrial testing applications has steadily grown in performance and international adoption. MarketsandMarkets Research predicts 16.5% compounded annual growth for PXI through 2024, driven by increasing R&D in aerospace, automotive, defense, and IT/telecommunications. MarketsandMarkets also notes rising PXI demand for reliability testing in the semiconductor market, where testing demands are prone to exceeding what “traditional approaches” (meaning dedicated-function test equipment) offer for analog, mixed-signal, and RF testing.

Therefore, PXI technology and specific ADLINK PXI products emerged as clear choices able to satisfy the client’s stringent requirements. This case spotlights a broad trend in the automotive space and points toward how companies in similar fields can use PXI to tackle comparable challenges with solutions based on open standards without sacrificing long-term reliability.

EV testing often must address multiple vehicle systems simultaneously. Input and output signals must be perfectly timed, which means testing operations must accommodate both multiple signals and I/O channels as well as synchronization across those channels to within fewer than 100 picoseconds (ps) of variance. When testing across multiple instrument modules are mandatory this synchronization challenge becomes even more difficult, but achieving and maintaining synchronization are mandatory in EV testing.

In addition, the consolidation of many larger devices into fewer smaller devices, has been at the heart of computing’s advances for decades. PXI brings that same principle to testing and measurement. ADLINK now combines PXI’s advantages for the automotive market with its own expertise in developing dependable, rugged computing platforms for industrial settings.

Naturally, not every testing and measurement instrument needs to be PXI. ADLINK’s EV client is integrating a broad set of solutions, of which PXI is only one notable technology. However, the company selected PXI to fill certain application needs because it was the best technology for its automatic testing needs. PXI will allow the firm to reuse and reconfigure its testing and measurement equipment for related applications years into the future as standards evolve.

In short, the PXI platform solutions implemented and optimised by ADLINK will provide the EV client with the highest levels of flexibility, total cost value, and effectiveness — all benefits that will contribute to the company’s competitive edge in one of today’s most exciting and important fields.

To find out more, please contact the ADLINK team: emea@adlinktech.com

Nicomatic’s high performance connectors are designed to withstand the rigours of extreme environments and have an enviable and proven record in space applications, aerospace, avionics, oil and gas, transportation and many other places subject to extremes.

Now Nicomatic, the leading manufacturer of high-performance interconnect systems, is in demand in another sector where extremes are the norm – that of motorsport.  The company’s engineers are currently working with multiple Formula 1 teams designing custom connectors and small modules to ensure ultra-reliable signal and power integrity in the latest-generation cars for this fast-paced sport.  Designs based on customised 2mm pitch CMM and 1.27mm pitch EMM Series interconnects, which are both highly modular, save space and even more vitally in F1 cars, weight, while at the same time ensuring reliable signal and power integrity under high-vibration and heat conditions.   Standard series CMM connectors, for example, save up to 60% space and up to 50% weight compared to other standard rectangular connectors with the same functionalities.  The EMM Series is 40% smaller than CMM and integrates features such as reversed contacts and 90° back protection.  

 Custom solutions are a Nicomatic speciality, with over 1,000 completed every year by its engineers to solve customer challenges and deliver an optimum performance solution.  The company uses modular manufacturing methods and has a dedicated custom-manufacturing area in its French factory.  Custom designs can be supplied in short lead times with no minimum order value.

According to Google Trends data, web searches for edge computing have increased by a colossal 473% in the last five years. Clearly, there’s an appetite for understanding the edge — but the technology has yet to be widely deployed in industrial applications. Here, Nevzat Ertan Chief Architect & Global Manager for Digital Machining Architecture at Sandvik Coromant, explains the misconceptions and barriers of edge computing for manufacturers, and argues the case for embracing the edge.

Defining the edge

First, let’s start by defining edge computing. Edge computing and edge analytics describe data capture, processing and analysis that take place on a device — on the edge of the process — in real-time. Unlike traditional methods, which typically collate data from several machines at a centralized store, edge computing is a distributed computing that brings a single, or a group of machines computation and data storage closer to the sources of data. This can improve response times and save bandwidth.

In an industrial environment, conducting analytics at an individual device can provide significant cost and resource savings compared to data processing using a purely cloud-based method. For clarity, this cloud-based, method refers to streaming data from multiple devices to one centralized store and conducting data analysis there.

Drowning in data

Using the centralised method, huge volumes of data must be collected and transferred to one place before they can be analysed. While there are advantages to having every piece of machinery data in a central hub, it can be painfully difficult to manage. This complexity will be heightened in facilities with a large number of machines, especially if the communication protocols differ on each device. Unfortunately, not all data speaks the same language.

This method can also create a massive glut of operational data — and weeding out insightful knowledge from the monotonous can be a painstaking task. Let’s face it, spotting inaccuracies in the metal cutting process of a large and expensive part is crucial knowledge, but the energy efficiency of a small conveyor at the end of the process, for instance, isn’t quite as valuable.

With edge computing, operators can instead set parameters to decide which data is worth storing — either in the cloud or in an on-site server — and which isn’t.

To be clear though, edge computing is not an alternative cloud-based methods, or an Industrial Internet of Things (IIoT) process in which cloud-based technology an edge computing can work together. These technologies are not competing against each other. In fact, each is making the other’s job easier. The computing environments associated with IIoT take a variety of forms, from an industrial PC (IPC) remote server to a gateway or back-office infrastructure. These tools are essential to support edge computing because they are distributed away from the core, or the cloud. They have the capacity to perform a variety of tasks — particularly tasks that don’t necessitate analytics at the edge.

The benefit of this combined model is that it allows enterprises to have the best of both worlds: reducing latency by making decisions based on edge analytics for some devices, while also collating the data in a centralised source. The model also allows future analysis of data and other processes, and the capturing of data required for regulatory reasons.

Edge computing in practice

As with other industrial innovations, some manufacturers perceive edge computing as daunting, unobtainable or out-of-reach. However, that couldn’t be further from the truth. The primary benefit of edge analytics is its scalability. Pushing analytics to sensors and network devices can significantly reduce the strain on enterprise data management (EDM) and analytics systems. Plus, there’s the opportunity to start small.

Unlike the smart factory concepts hailed in the early 2010s, deploying edge computing does not require an entire systems overhaul or investment in several machines. Instead, manufacturers can opt for just one device that provides analytics at the edge.

For instance, with Sandvik Coromant’s CoroPlus^® edge computing offering, intelligent tools and sensors can be deployed on one piece of equipment. This has proven especially beneficial in the boring of large components, for example, where one small mistake can be incredibly costly.

To avoid mistakes, the newly-launched machine integrated version of Sandvik Coromant’s Silent Tools™ Plus, with CoroPlus® Connected, uses data generated at the cutting zone to identify potential problems. Automated cutting actions can then be applied to avoid any costly mistakes.

Overcoming barriers

As with all industrial technologies, security concerns about edge computing are rife. In fact, according to a Kollective report, 66 percent of IT teams view the architecture as a genuine threat to their organization. The primary reason for this concern? Apprehension about edge security.

Naturally, the distributed nature of edge computing does require some changes to security methods — especially if the facility has relied previously on a traditional centralized or cloud-based infrastructure. With edge computing, data instead travels between different distributed nodes, which may require special encryption mechanisms that are independent of the cloud.

On the other hand, processing data at the edge minimizes the transmission of sensitive information to the cloud. Some could argue this is more secure but, in reality, it depends on your security protocols.

That being said, malicious, routing information and Distributed Denial of Service (DDoS) attacks are still possible — as they are with any internet-enabled device. The first and most important step is to seek confidence and reassurance from the manufacturer of your edge device.

At Sandvik Coromant, for instance, we’ve designed a new security principal to give our customers peace of mind. It’s been developed to support the ANSI/ISA-95 standard, an international standard from the International Society of Automation for developing automated interfaces between enterprise and control systems.

Better understanding

Edge computing is widely hailed as a ground-breaking technology for the industrial realm, and wider IT applications. However, there are multiple misconceptions that must be dispelled before edge systems are deployed in industrial settings.

First, the technology doesn’t replace IIoT, nor does it compete with other cloud-based analytics methods. In fact, the technologies must work harmoniously for manufacturers to reap the true benefits of edge computing. Similarly, the technology doesn’t pose any greater security risk than existing internet-enabled data collection methods. Security protocols may simply need updating.

It’s clear that edge computing can provide significant benefits to manufacturers. They include reducing the latency involved in decision making, optimizing cloud-based data collection, and reducing the energy required to consistently stream data from every device in a facility to a centralized hub.

What’s more, deploying edge computing is more straightforward than many believe. Manufacturers needn’t overhaul entire systems to reap the benefits of the edge. The proper deployment of edge nodes can provide several benefits including reduced latency for real-time applications, more efficient use of bandwidth and storage resources, enhanced scalability, reduced energy costs, improved environmental performance, as well as better opportunities for privacy control and data protection.

As Google Trends data shows, interest in edge computing is growing. But manufacturers must fully understand its potential before they invest.

The organisers of AQE 2022 are delighted to announce that this year’s event will take place live at the Telford International Centre on 12^th and 13^th October. In common with previous AQE events, visitors will be provided with a comprehensive package of training and development presentations on the latest regulations, standards, test methods and monitoring technologies involved with the measurement of air quality and emissions to air.

Both AQE and the co-located WWEM (Water, Wastewater & Environmental Monitoring) programmes are supported by a comprehensive range of seminars, and two major international exhibitions featuring most of the world’s leading suppliers of environmental monitoring equipment, analytical testing instrumentation and support services.

Registration for both AQE and WWEM is free and available from www.ilmexhibitions.com. By registering prior to the event, visitors will be entitled to free parking, free refreshments and complementary access to both events.

The two main components of AQE are air quality (indoor and outdoor), and industrial emissions. The air quality programme has been configured by Jim Mills, a well-known figure in the sector and now and independent consultant with Scotswolds Ltd. Presentation titles, abstracts and author details are published on the AQE website, but the main themes are described below.

Speakers from government/regulators will summarise the implications of the Environment Act 2021 with regard to ambient air quality, explaining the targets and timelines that have been specified. For example, the Act establishes a legally binding duty to bring forward at least two new air quality targets in secondary legislation by 31 October 2022. The proposed targets relate to PM2.5 with a 2040 objective, which is a concern for many stakeholders. These issues will be addressed by subsequent speakers from philanthropic organisations which are engaged in air quality matters by funding research, undertaking monitoring and other initiatives, whilst also lobbying policy makers, seeking to improve environmental legislation and hold the government to account.

There will also be presentations by the UK’s Air Quality Expert Group (AQEG), which provides advice to the UK government, and from NPL, the UK’s National Physical Laboratory, who will outline the latest work on the standards and methods that underpin air quality science.

A speaker from the QUANT programme will describe the findings of a real-world open and traceable assessment of low-cost sensors and sensor networks, and their calibration, and others will focus on the measurement of Black Carbon, and also how CO2 measurements can contribute to source attribution and to the calculation of emissions indices. A potentially game-changing project will also be described, in which air quality monitoring networks are being hosted by existing cellular communications network infrastructure.

In the past, there have been concerns that monitoring and modelling have been regarded as almost separate methods for the assessment of air pollution, but speakers will outline the case for greater integration. Monitoring should be used to calibrate and verify modelling predictions, and recent advances in low-cost sensors mean that greater spatial density of monitors can be deployed to enhance the reliability and granularity of modelling predictions.

In the general media and in the minds of the public, air quality and climate change are frequently represented as the same environmental problem. However, not all air pollutants have a greenhouse gas effect, and greenhouse gases are not usually toxic. Nevertheless, local air quality strategy is often separate to local climate change strategy. This might be because they may have separate budgets in both central government and local authorities, but this session will explain why both strategies should be combined. For local authorities, the greatest impacts on both air quality and climate change come from planning and development, so it is vital that these issues are addressed in the planning process.

While it is important to reduce outdoor pollution, it is even more important to protect the quality of indoor air. When people meet indoors, carbon dioxide levels increase, and it is well known that this can cause drowsiness and harm the performance of office workers and schoolchildren for example. However, the Covid pandemic further highlighted the importance of ventilation because the concentration of airborne infectious aerosols also increases in populated rooms with inadequate ventilation. Speakers will therefore describe a government pilot study in which CO2 and particulate sensors are being used to monitor ventilation in schools.

The regulations, standards and methods relating to the measurement of industrial emissions have been a key feature of all AQE events and the MCERTS events before that. AQE 2022 will continue to address this core issue with an additional focus on the role of monitoring in the fight against climate change.

The Environment Agency will set the scene with a presentation on relevant regulations, after which the Environmental Services Association (ESA) will outline a strategy for the recycling and waste sector to meet Net Zero. Both of these presentations will be given with particular reference to the monitoring requirements. One of the speakers will also address the challenges of monitoring biogenic and fossil carbon emissions, because global initiatives are under way to reduce the use of fossil fuels, which has resulted in an increase in the use of fuels of biogenic origin as a replacement.

Carbon capture represents an important opportunity to lower carbon emissions; however, amine solvents are used in some carbon capture processes, which can react to form new compounds within the plant’s emissions. Rod Robinson from NPL will therefore summarise current research projects and the requirements for monitoring amine emissions. There will also be presentations on continuous sampling, with help and guidance from an operator’s perspective.

The second day of the AQE emissions monitoring programme will focus on data acquisition, handling and reporting. The final session will be a panel discussion, addressing all or any of the subjects covered by the emissions monitoring programme.

Summarising the plans for these two events, Marcus Pattison says: “It is tremendously exciting to be able to run a physical event again. This year the volume of available content is incredible – I would urge everyone to plan their trip very carefully so that they can jump in and out of their sessions of most relevance, to maximise the benefit of their visit.

“Can I also ask everyone to REGISTER NOW at www.ilmexhibitions.com – it’s free and only takes a few seconds. Registered visitors will be entitled to free parking, free entry, free lunch and refreshments, but most importantly, they will be provided with free access to all of the presentations (both AQE and WWEM), both exhibitions and all of the seminars and workshops that will take place!

“Telford benefits from easy access and the International Centre has hotels on site, so that visitors can stay for both days. So, as you can probably tell, we are really excited about this year’s events and we can’t wait to see everyone in Telford!”

In order to cope with the fast-growing energy transition market demanding flexible high-power capabilities, the integration of power systems and associated cable assemblies must be secure, cost-effective, and space-saving. However, high-power modules in the current range between 70A and 200A have conductors with large wire-cross sections, even up to 70mm². These wires are often challenging to handle because the thickness reduces the bending radius and requires adequate floor space.

The new MIXO right-angled high-current rectangular connector modules (CX-01YA) are designed to minimize space installation requirements with a compact 90° connection that removes bending of large diameter wires (up to 70mm²) and ensures reliable 200A rating performance. The main feature of this new module is the special insulating cover plate that can not only prevent accidental contact between cable lugs on adjacent modules but also save the nominal voltage rating of 1000V planned for the 200A modules while connecting the DIN 46235 pre-insulated crimp cable lugs.

These 200A right-angled modules with the screw termination are compatible with the standard bulkhead mounting housings. They also can be used to extend a busbar connection or to power control cabinets, HVAC systems, and batteries for energy storage backup applications.

For more information, contact the factory or visit www.mencom.com.

AMETEK Land, the world’s leading manufacturer of monitors and analysers for industrial temperature measurements, celebrates 75 years of producing innovative systems and solutions for industries including metals, glass, hydrocarbon processing and power generation.

Founded in 1947 by Tom Land, AMETEK Land now employs around 150 people worldwide, supporting customers with industrial temperature measurement, combustion efficiency and emissions monitoring. 

The company has seen many notable milestones in its history; AMETEK Land launched its first surface pyrometer in 1958, followed by its first non-contact infrared pyrometer along with a blackbody calibration source in 1965. This was a game-changer in safety and accuracy, allowing for faster and more efficient temperature readings in industrial operations.

Looking to the future, AMETEK Land is continuing its innovation and technological advancements, to enable its customers to meet the highest standards of plant safety, process control and product quality.

David Primhak, Director of Sales and Product Management at AMETEK Land commented: “As a company, we are incredibly proud of our contribution to industrial manufacturing. We have a magnificent team leading the way in product development and advanced technologies, developing new solutions and updating existing systems to help improve safety, increase yields, and reduce carbon footprints.

“Decarbonisation is top of the agenda for us all, and we’re working closely with our customer base to understand their needs and help them achieve their decarbonisation goals as the world becomes greener.”

AMETEK Land offers a range of products used by industrial manufacturers worldwide, including the SPOT range of non-contact pyrometers, the NIR-B thermal imaging borescopes, as well as supporting software including the latest IMAGEPro.

This is backed by a team of experts including physicists, research and development professionals, and production teams, all of which contribute to the success of the business.

AMETEK Land became part of AMETEK, Inc.  within the Process & Analytical Instruments Division in 2006. This business alliance means that Land benefits from being part of a corporation with global supply chains and business functions.

Find out more at ametek-land.com.

What would our world look like in 1D or 2D? Well, 3D is our natural human visual reality and it is impossible to imagine life without it. In recent years, 3D has also become more and more a reality in modern high tech. How do designers and engineers in medical device technology use this new design freedom of three-dimensionality?

Japanese corporation Yaskawa coined the term “mechatronics” in 1969 by combining “mechanical” and “electronics.” Since then, steady developments in technology—notably at drives systems and wireless connectivity—have significantly expanded its usage.

Today, medical devices are a major focus of mechatronics. One of its breakthrough innovations are Mechatronic Integrated Devices (3D-MID). It’s a technology that allows higher density integration of electronic components into the smallest possible space. When it comes to miniaturisation, the ideal partner is the leading 3D-MID supplier HARTING. The company is located in the innovative heart of the Swiss watch industry in Biel, which is also a growing hub for medical device technologies. This location was chosen with care, because in this region people have grown up in a world of micromechanics – generation after generation.

3D-MID or 3D-Circuits, has the potential to transform medical industry as we know it. As medical devices such as hearing aids and dental instruments become smaller and smaller, the manufacture of their most important elements – traditionally printed circuit boards (PCB’s with wires and other electrical parts) require much more delicacy and precision.

High-end miniaturisation is facilitated by 3D-Circuits: a fantastic combination of mechanical and electronic integration.

This article breaks down everything you need to know about 3D-MID technology, its many benefits, and its applications in the medical device industry.

All About 3D-MID Technology

HARTING’s 3D-Circuits technology makes it possible to combine mechanical and electronic functions into a single component to fit into the smallest spaces.

The electronic circuit can be built into the device itself, making it more compact and functionally dense. By using injection-molded circuit boards, the number of process steps, assembly times, and parts can all be drastically cut down.

3D-MID technology has become incredibly useful in many industries, especially so in the world of medical devices, where it drives miniaturisation.

How 3D-MID Technology works

Device designers can go above and beyond the limits of traditional manufacturing with the help of 3D-Circuits. The sky’s the limit when electrical and mechanical functions can be unified in a single three-dimensional component.

These components are constructed using very malleable bits of plastic through injection molding. This process makes it possible to create anything with precise measurements according to the requirements laid down by final customer usage.

Injection molding is perfect for mass production of products with complex geometries and in miniature sizes, such as the components of high-end medical devices. A process called laser direct structuring (LDS), developed by LPKF Laser & Electronics in 1996, can then draw the needed electrical trace layout to these components, which will be made conductive in a subsequent chemical plating process. As HARTING unifies all these process steps under one roof, customers benefit from quality “Made in Switzerland”.

With 3D-MID technology, there are virtually no limitations for designers. This opens up a world of possibilities and potentially huge savings for manufacturers and consumers alike. By combining mechanical and electrical hardware, the design and creation of electronic devices with very complex functions become easier and much more affordable.

Because of its adaptability, mechatronics can be used in an ever-expanding variety of medical applications, ranging from bed positioning systems to robotic surgical equipment.

3D-MID Technology in the Medical Field

In the last few years, 3D printing has accelerated many advancements in the world of medicine, with millions of people benefiting from components and devices created with ease. And now, 3D-MID is poised to change the face of medicine forever.

This technology takes all these advancements one giant step further by using mechatronics to create devices with an even wider range of electronic functions that fit in the smallest of spaces.

Mechatronics allows for the extreme downsizing or miniaturising of medical applications, enabling examination, sensing, and monitoring from within the patient. With such technology, medical devices can be designed to be much less invasive, leading to a significant improvement in patient care. With its many years of experience – HARTING started its activities in this field in 2003 – the team is familiar with the requirements of the medical market. The numerous series production projects confirm this. Taking large medical machines and devices and putting them into a more compact package is a big part of what 3D-Circuits brings to the table. It offers significant improvements to changing how medical devices are used today.

One of the most important benefits of this technology is that it makes these advances possible without sacrificing quality. You may think that shrinking a medical device down would make it less powerful or effective, but with 3D-MID, that isn’t the case at all.

In fact, as 3D-Circuits continues to grow in popularity, it will only get better, opening up new options for even smaller and more effective medical devices, from hearing aids and implants to surgical and dental instruments.

The Benefits and Uses of 3D-MID Technology

Miniaturisation is one of the most critical trends in healthcare that affects how mechatronics technology is used. The development of ever-smaller instruments, devices, and equipment enables less invasive treatment methods, allowing faster recovery times and much-improved patient care.

These micro actuators and miniature sensors also propel the development of small mechatronics systems for the following applications:

• Handheld diagnostics for use at the point of care, including ultrasound and blood testing
• Scientific instruments for flow cytometry, DNA identification, pathogen detection, and DNA sequencing
• Medical imaging using small, precise modules for lens control and laser tuning
• Implantable devices that can be dynamically adjusted in-place
• Mobile miniature robots
• Micropumps and auto-injectors for drug delivery products

There has also been a shift toward placing a greater emphasis on the convenience and aesthetics of medical technology as well as the level of comfort experienced by a patient. This is because more treatments are shifting from hospitals to outpatient settings, and today’s discerning customers now expect a more positive experience as a patient.

Redesign efforts for medical equipment aim to make them easier and more convenient for patients to use and manage in the long run.

Even conventional hydraulics are being phased out and replaced with mechatronics as the method of choice for controlling motion. Mechatronics systems are much simpler to operate, create less noise, weigh less, and are more compact.

Some of the value-added benefits that medical organisations can gain from using mechatronics in place of more conventional manufacturing methods:

• The miniaturisation of medical devices
• Development of low-cost disposable gadgets, which has become a pressing requirement
• Device portability
• High levels of accuracy and precision
• Improved performance in all aspects
• Design freedom
• Weight reduction
• Simplification of products

Conclusion

The most important developments in mechatronics lead to new technologies that will shape the healthcare of the future so that devices are safer, more portable, and, most importantly, painless. HARTING’s 3D-Circuits technology is changing how medical devices are made, especially complex equipment with integrated electronics that must fit into increasingly miniscule spaces.

Farnell, an Avnet company and global distributor of electronic components, products and solutions, has today announced its participation at E-22, Denmark’s largest electronics event running from August 30 to September 1 at the Odense Congress Centre. Farnell is partnering with AVNET Silica at the event and will showcase its growing industrial automation and control product range of more than 80,000 competitively priced solutions, and broad electronics portfolio.

The E-22 exhibition is the largest event in Denmark for industrial and electronic design engineers wanting to explore the latest news, technologies, machines and solutions. A range of technical conferences and events will be held over the three-day event to provide opportunities for attendees to network with experts from the electronics industry to learn how to boost efficiency, reduce costs and optimise operations to achieve sustainability.

Visitors to Farnell’s Stand 4618 in Hall C will have the opportunity to meet company representatives, including Thomas Norregren Grunnet, and David Avital, Farnell’s Account Managers for Denmark, and Ghita Hoyer, Farnell Regional Sales Manager, Nordics & Baltics, to discuss new business development opportunities and future projects. Customers will benefit from Farnell’s technical expertise, sales experience and global distribution network, and can also find out about Avnet’s broad ecosystem when seeking to upscale new or existing solutions.  

Farnell stocks more than 950,000 products in its global online catalogue with more than half a million products stocked in mainland Europe. Innovative solutions from leading global manufacturers including NXP, Renesas, onsemi Semiconductors, Microchip, Microsoft, Torex, and Micron will be on display on Farnell’s exhibition stand. 

Live product demonstrations will be available featuring the new-to-market Dual Channel Digital Storage Oscilloscope (MP720011) from Multicomp PRO. The MP720011 is an economical 100MHz digital oscilloscope which features a large 7” high resolution LCD colour display, front-sided USB CI design and ultra-thin device body. New and experienced customers can efficiently retrieve test and measurement data using the user-friendly interface and accessible operation menu. The available Windows extension offers extra functionality by facilitating the observation of abnormal signals from full waveforms. 

Ghita Hoyer, Farnell Regional Sales Manager, Nordics & Baltics, says, “We are very pleased to be back at E-22 and invite our customers to make the most of this exciting opportunity to reconnect with our technical experts and sales team. Farnell is committed to supporting our production and design customers in Denmark to embrace new technology and drive innovation. Our goal is to help customers at all stages of their digitisation journey to improve production processes and enable new product design to increase profitability of their organisation and the region.”

This year, the E-22 event will present two dedicated conference strands covering production in Denmark and development in Denmark. The ‘Production in Denmark’ strand will focus on environmental issues, energy consumption and automation. ‘Development in Denmark’ is a new initiative that will assemble Danish companies and industry specialists to collectively examine prospects for innovation and business development in Denmark.

Farnell provides specialist 24/5 technical support covering new product design for specific applications in pneumatics, industrial automation and control technology. Free online resources, data sheets, application notes, videos and webinars on also provided on the Farnell website.

Customers can also benefit from no minimum order quantity, contract pricing and flexible pricing options as well as scheduled and consolidated orders with Farnell.

Don’t miss this opportunity to visit Farnell at E-22 (Stand 4618 in Hall C) at the Odense Congress Center from August 30 to September 1.

For more information on where Farnell will be exhibiting in 2022, please visit here