Features

With its subsidiary TECO 2030, the Norwegian marine equipment supplier TECO Maritime Group is pursuing the goal of accelerating the environmentally friendly transformation in the maritime sector. To this end, the company is developing hydrogen fuel cells that will enable ships and other heavy-duty applications to become emission-free. In future, TECO 2030 will use CVM systems from SMART TESTSOLUTIONS to monitor these fuel cell systems.

SMART TESTSOLUTIONS is primarily known in the eMobility environment for its systems for cell voltage monitoring (CVM) on fuel cells. Most recently, the company has further developed its CVM G5S cell voltage monitoring system into a series solution that, in addition to the CVM measurement modules, also includes elements for cell contacting (cell full-day pickup) as well as cable harnesses and mechanical parts for mounting the system.

The complete CVM systems are individually adapted to the respective fuel cell application of the customer. The Norwegian ship chandler TECO also receives a solution tailored to its needs. Adaptations are mostly necessary in the area of cell contacting. This is strongly dependent on the cell design, and at the same time the requirements are high. The contacting must be electrically functional, insensitive to vibrations, as space-neutral as possible, temperature-resistant and cost-effective. In addition, it should be possible to automate the assembly to a large extent in the course of series production.

In addition to TECO 2030, SMART TESTSOLUTIONS has recently been able to win several customers from the research sector as well as manufacturers of electrolysers for its CVM systems. Numerous automotive manufacturers and suppliers as well as companies from the aerospace industry and other ship suppliers have been on the customer list for some time.

For signals, data, and electrical power: M12-type connectors have become indispensable interfaces for device connectivity. binder is supplementing its M12 lines with additional products that support users in automation technology to achieve efficient, flexible, and error-free installation.

binder, a leading supplier of industrial circular connectors, has expanded several M12 series for automation technology with various products. Applications range from basic sensor/actuator cabling to industrial measurement and control technology as well as industrial Ethernet to autonomous robots or cobots. The product development was based on the requirements of the M12-relevant DIN EN IEC 61076-2 standard. It follows current trends with regard to miniaturization, variability in use and cost efficiency.

Like all M12 series from binder, these products meet at least the IP67 protection degree. They are mechanically robust, durable, and designed to be user-safe thanks to coding. Several shielded or shieldable product versions are available with regard to application in electromagnetically loaded industrial environments.

For the current year, binder has announced further new developments in the field of push-pull locking and M12 one-cable solutions.

M12 basics: the backbone of networking in the IIoT

Originally used primarily in vehicle engineering, M12 has become established since the 1980s as an extremely robust, reliable, and compact, but also high-performance interface in automation technology. It is used in new machinery and systems as well as for modernizing existing infrastructure. The more the Industrial Internet of Things (IIoT) prevails in modern factory and process plants, the more the number of networking-capable automation components rises – and consequently the need for industrial interfaces of this kind.

Depending on the coding and design, M12 connectors can transmit signals, data, and, if required, electrical power between field devices, such as sensors, controllers, or drives, and other network nodes. On the one hand, they are able to handle the high data rates of modern Ethernet networks. On the other hand, they can also supply components such as drives with high power levels. In order to make the best possible use of available installation space, it is advantageous to transmit data and electrical power via one and the same connector. Such hybrid solutions are becoming increasingly attractive, but are particularly demanding in their technical implementation.

The A coding (application area: sensors, DC power) is available with 3, 4, 5, 8, and 12 pins. The B (Profibus), D (100 Mbit Ethernet) and X (10 Gbit Ethernet) codings with 4 and 8 pins, respectively, are suitable for data transmission at different transfer rates.

In the case of power supply, for example for AC drives and frequency converters, S and K (up to 630 V(AC) at up to 16 A) and, for example for DC drives or LED lighting, T and L (up to 63 V(DC) at up to 16 A) apply.

All M12 connectors provide minimum IP67 protection against dust and water ingress. Special variants are also available in IP68 and IP69K for hygienically demanding applications. Depending on the design, the M12 connectors are intended for different application scenarios: Versions with special termination such as crimping or wire clamp technology are suitable for applications with vibrations; others are suitable for outdoor use and, for example, resistant even to UV radiation. Depending on the application field, metal, plastic or stainless steel housings are used.

M12 innovations: optimised for the IIoT

As field devices increase in functionality, their power requirements grow. In addition, the density of interfaces increases, which requires particularly compact connectivity solutions. For device supply with 63 V(DC) at up to 16 A, binder has expanded its M12 portfolio by panel mount connectors with L-coding and dip solder contacts. The space-saving 823 series products are suitable for manual, wave, and reflow soldering on printed circuit boards. Protected to IP68 when mated, they are designed for both front and rear panel mounting, with their sophisticated two-piece design helping eliminate potential failure sources: Because the mounting body is soldered to the PCB but the flange housing is attached directly to the device, soldering can be done without the housing, which in turn can be mounted without disturbing the solder joints.

The time-consuming and error-prone single-core wiring is no longer necessary with ready-to-connect cables, such as those also offered by binder in the M12 segment. The pre-assembled, overmolded products, which have already been tested in accordance with DIN EN IEC 61076-2, significantly reduce the installation and cabling effort and help to implement cost-efficient plug&work concepts. The binder portfolio of ready-to-connect cables in the M12 segment includes a number of versions: Straight and angled products, as well as products molded on one or both sides, with various codings and in different cable qualities are available with 3 to 12 pins

M12 outlook: single-cable solution and push-pull closure

binder is responding to the trend towards miniaturization and reduced installation effort with its own single-cable solution for the M12 segment. The M12 connector combines 7 signal contacts with 2 power contacts and thus enables power and signal supply in just one connector. Rated currents of 12 A and voltages of up to 63 V are possible for power supply, and 0.5 A and up to 12 V for signal transmission. In addition to the panel mount parts with THR or SMT contacts, there will also be those with wires, and variants with stainless steel and plastic housings will be available. The hybrid connectors are also designed for use in outdoor applications and thus expand the range of applications enormously.

Additionally, binder announces the development of M12 connectors with outer push-pull locking. This variant complements the M12-threaded products with push-pull locking in M12 design. Instead of screwing, here the cable side latches with the device side when the plug is pressed on. The product design follows DIN EN IEC 61076-2-010, ensures backwards compatibility with M12 screw locking on the device side and thus represents a particularly flexible and time-saving connection concept.

About binder

binder, headquartered in Neckarsulm, Germany, is a family-owned company characterized by traditional values and one of the leading specialists for circular connectors. Since 1960, binder has been synonymous with the highest quality. The company works with more than 60 sales partners on six continents and employs around 2,000 people worldwide.

The binder group includes the binder headquarters, 16 affiliated companies, two system service providers as well as an innovation and technology center. In addition to Germany, the binder sites are located in Austria, China, France, Hungary, the Netherlands, Singapore, Sweden, Switzerland, the UK, and the USA.

element14, an Avnet community, recently announced the winners from the Summer of Sensors Design Challenge which launched alongside a series of educational webinars this past summer and ran throughout the year. Participants had the opportunity to advance their skillsets and showcase what sensors can do while utilizing specific sensory kits provided by the challenges’ sponsors.

“We are excited to celebrate the hard work of all competitors throughout the course of this challenge. We are especially thankful for our partners who helped us supply the sensory kits for each challenge and made this possible,” said Dianne Kibbey, Global Head of Community and Social Media for element14. “We are blown away by the ways that our community continues to innovate and think outside of the box during these challenges and are excited to continue to support them with new opportunities this year.”

Of the participants, four were selected as winners by the element14 Community team of judges:

• TAG You’re It: Best use of NFC smart asset tracking sponsored by ST Microelectronics: With five blog posts completed, the winner of this challenge is Rahul D. from India. He created smart container tracking which featured NFC enabled GPS fleet tracking, online thing speaks IoT web dashboard, NMEA messaging, GPS RTK receiver and GUI.
• In the Air Tonight: Best air quality application sponsored by Renesas: With 15 blogs completed, the winner of this challenge is Michal Zurek, from the Czech Republic who created his own PCB. He also explored the color sensor in another six-blog series after completing the challenge.
• Exploration Station: Best use of SensorXplorer sensors sponsored by Vishay: With more than nine blog posts, the winner of this challenge is Owen Jeffreys, a UK based community member who created an adaptative light bulb controller which he named IntelliLight.
• Under Pressure: Best use of Bio Sensors sponsored by MikroElektronika: With over five blog posts completed, the winner of this challenge is Milos Rasic, from Serbia who created a small health monitoring system for the elderly.

Winners were judged on a variety of components, including how creatively they used their kits and the completion of at least five blog posts throughout the competition. Every challenger received a finisher prize of a Multicomp Pro Multimeter and the winners all received an 11″ iPad Pro plus a second gift specific to their challenge, including a Philips AC0820 Series 8 Air Purifier, an Apple Air Tags 4 Pack, a Garmin GPS Rugged GPS Smart Watch, and an Under Bed IoT Sleep Tracker.

To see all the winning designs, and to learn more about the element14 Community please visit: https://community.element14.com/challenges-projects/design-challenges/summer-of-sensors-design-challenge/w/documents/27919/summer-of-sensors—winners-announcement

Correctly measuring acceleration on angled surfaces is one of the major challenges of modal analysis. With the accelerometer type 8775A, Kistler presents a new piezoelectric sensor solution that has been especially designed for angled structures such as airplane wings. Thanks to its cylindrical shape, it is freely orientable while meeting all other key requirements for accelerometers such as low weight, high sensitivity and low noise threshold.

During starts and airborne manoeuvres, an airplane’s wings and corpus experience acceleration from different angles. Modal analysis simulates the impact that acceleration has on an airplane in ground vibration tests. Choosing the right accelerometers is crucial for achieving precise test results. Working closely with clients, Kistler has recently developed the cylindrical accelerometer 8775A. Used either on its own or mounted into a Delrin mounting block, the accelerometer can be oriented freely in any direction perpendicular to the coaxial connector. It then measures vibration in the direction of the arrow etched onto the surface of the sensor. “The structure of an airplane impacts the direction in which acceleration hits specific parts,” explains Joshua Kasprzyk, Product Manager Acceleration at Kistler. “When you take a wing, for instance, the curved structure affects the angles in which vibration will be seen. When using standard accelerometers with a square package for modal analysis, they can only be oriented towards angled accelerations to a limited extent. Our new sensor offers an optimal solution for this issue.”

Meeting all requirements for modal analysis

To accurately measure vibrational input on an airplane’s structure during modal analysis, accelerometers must fulfil several requirements: The sensors should be durable, lightweight, highly sensitive, have a high signal to noise ratio and very few crosstalk effects to other influences. For testing these complex structures, several hundred accelerators need to work smoothly alongside each other. The type 8775A accelerometer uses shear element technology that offers high immunity to base strain to meet these demands. Built from titanium, the lightweight, hermetic sensor covers an acceleration range of 50g and can withstand a range of temperatures. While aerospace and aircraft applications typically require the sensor to be mounted with the Delrin mounting block, it can also be used on its own for other applications. In that case, for instance in small and tight measuring environments, the sensor can be fixed to the surface with a clamp or bolt. For underwater applications, it can be equipped with a selectable IP68 waterproof cable.

The new accelerometer 8775A was well received by its first clients: “Over the past year, this accelerometer has been tested by clients in modal analysis projects,” says Joshua Kasprzyk. “Their positive feedback has encouraged us to launch the sensor on a larger scale.”

Perhaps one challenge delaying engineers and designers from exploring SMART sensors is having easy access to program them – Therefore, in February, Contrinex will launch PocketCodr, a hand-held unit which links to a Smartphone app-based configurator, making it easy to explore the power of Contrinex’s high-resolution SMART inductive and photoelectric digital-measurement sensors.

PLUS Automation received a PocketCodr as a Christmas present from Contrinex, and so we have already been able to see how easy it makes setting up and monitoring SMART sensors. We connect the app on our phone to a touch-screen laptop, enabling us to demonstrate how easy it is to use the configurator on a large screen – You can’t do that with the more usual gift of ‘Christmas socks’.

The PockerCodr app, which is available on the Google and Apple app stores, presents a graphical user interface, and features ‘Action Widgets’ which enable users to interact directly with sensors, see real-time parametric changes on live data charts, and store, and retrieve settings.

The PocketCodr not only simplifies the configuration and commissioning of SMART sensors, but it also allows engineers to set up and interrogate any IO-Link-enabled device. For example, we have used it to reconfigure normally-open sensors, into normally-closed sensors, for a customer.

Contrinex’s ground-breaking SMART sensors offer machine designers efficiency gains, cost reductions, higher throughputs and reduced waste. SMART photoelectric sensors are soon to be launched to complement the existing SMART inductive sensors. The photoelectric sensors will offer SMART functions in addition to measuring distances up to 300mm, in either 30 x 20 x 10mm C23 cubic or M18 cylindrical bodies.

Cherwell, specialists in cleanroom microbiology solutions for the pharmaceutical, healthcare and related industries, has published an update to its guide on “Environmental Monitoring Processes and Validation”, incorporating specific detail on the new version of EU GMP Annex 1. This aims to help sterile medicinal product manufacturers with reviewing and improving their Environmental Monitoring (EM) programs in preparation for compliance with the revised guidelines by August 2023.

Available to download from Cherwell’s website, the new eBook follows Cherwell EM experts’ detailed review of all changes included in the extensive 59-page 2022 revision of these key regulations governing the manufacture of sterile medicinal products in the UK and Europe. Cherwell’s updated guide adds new and more detail on a number of areas including: Risk-based facility management; Zero CFU; Continuous EM; Trends monitoring; Personnel training; and VHP fumigation.

Cherwell’s EM eBook also includes an update to its section discussing how to achieve Annex 1 compliance in EM processes and programs by taking a practical and bespoke approach to understanding the level of compliance required by individual facilities. This can be achieved by breaking down preparation into four steps, starting with a full EM audit and analysing every aspect of a facility’s current EM program. To help further understanding, the guide also offers examples of best practice EM programs within both industrial pharmaceutical and commercial scale hospitals and aseptic compounders.

In order to maintain industry knowledge and stay up-to-date with the latest developments, including regulations such as the new EU GMP Annex 1, in addition to in-depth scientific reading, Cherwell’s team regularly attends industry conferences and events. This enables the team to work in partnership with and advise customers when reviewing their EM and contamination control strategies.

“At Cherwell we strive to best support our customers in making the right decisions associated with combining methods and instruments to cost effectively achieve the best results for their individual EM and validation protocols,” said Thomas Parkhill, Microbiology Sales Specialist, Cherwell. “In this eBook, we offer a consultative guide to the most business-efficient EM measures organisations can adopt to comply with GMP Annex 1, and practical steps they can take to create the ideal EM process for their specific business needs.”

Hamish Hogg, Microbiology Product Specialist, Cherwell, added, “The sheer volume of new content in the much-revised GMP Annex 1 alone does present a challenge for businesses wanting to comply; they might be overwhelmed by the choices needed in order to determine the right path for them. That’s why we aim to work in an advisory role with our customers and assist them by drawing on the extensive knowledge and expertise held within our team. Our newly updated EM guide is just one such example.”

Faster and higher-resolution image sensors, interfaces that support ever increasing bandwidths, simpler integration, minIaturisation and high on-board processing power are driving innovation in machine and embedded vision applications. Paul Wilson, Managing Director of Scorpion Vision, charts the current trends in cameras and components.

Ultra high resolution image sensors: image sensor megapixel counts are continuing to climb, enabling industrial cameras to capture more picture detail. This not only means that microscopic defects can be detected, but also that a single camera can cover a larger area. Applications that have historically required multiple cameras may be carried out using just one high resolution camera, introducing huge potential for cost savings through reduced complexity, processing, management and capital outlay. Using a single camera eliminates the need to stitch together multiple images – driving performance improvements by shortening image processing time.

Larger lenses: the bigger the sensor, the larger the pixel area and the better the image quality…higher resolution sensors go hand in glove with larger lenses if a ‘tunnel effect’ is to be avoided. This is a major consideration when designing machine vision systems, as c-mount lenses are designed for sensors of up to a little more than one inch – anything bigger and a large diameter aperture lens is needed.

Micro lenses: at the opposite end of the lens size spectrum there is a surge in demand for M12 miniature lenses for use in embedded cameras, drones, robotics and autonomous vehicles. One of the reasons for this rise in popularity is that the quality of these lenses has improved dramatically in recent years, enabling them to be deployed in applications that were previously the preserve of c-mount lenses. Miniature lenses can be now incorporated into machine vision cameras, resulting in highly compact systems. This is particularly advantageous where space is at a premium and there is a cost benefit.

Filter application technologies: the use of filters to block out certain bandwidths of light is nothing new in itself, but the technologies for applying filters to industrial cameras are evolving. For example, adapters for M12 lenses are now available that allow ambient light to be filtered out in the same way as with c-mount lenses. This means M12 lenses can be deployed in light sensitive applications, such as in robotics systems for factories where ambient light is constantly changing. The use of filters that only allow light in the near infrared bandwidth is commonly used to mitigate against varying ambient light.

10 GigE protocol: as the successor to GigE, 10GigE provides the same benefits but with a ten-fold increase in data rate and frame rate. To take a step back, historically, machine vision system designers have had a choice of GigE or USB3 as the protocols for transmitting high-speed video and related data over ethernet networks. This decision tended to hinge on the length of cable required, which in turn related to the number of cameras. USB is rated for five metres or less, whereas a GigE interface can function with a cable length up to 100 metres. The trade off with a one GigE interface is speed – a USB3 cable can transmit data five times faster than a One GigE system. The advent of 10GigE will enable the capabilities of high performing image sensors – until now, limited by the bandwidth that could be achieved with the available interfaces – to be realised and exploited.

Embedded vision: these low cost cameras are increasingly infiltrating the industrial world. The main difference between embedded vision and machine vision is that embedded camera technology is far simpler owing to limited data processing capacity. This means it is more suited to gathering data, which is then analysed on a cloud-based platform, than processing online data and making decisions in real-time. There are several examples of embedded cameras being used in a commercial context: in vertical farms they are monitoring and adjusting ambient conditions for optimum plant growth; and in a retail context they are utilised in stock-taking robots.

Stereo vision for the masses: in the past, stereo vision was seen as the domain of experts and required investment in costly software. Now, thanks to the development of low cost stereo vision sensors by companies such as Arducam, cameras can be paired with open source stereo vision AI algorithms and 3D capabilities to create systems that are very proficient at depth sensing – an example might be a robot that navigates its way around a warehouse. The limitations of this technology should be respected though – the hardware isn’t capable of tasks that require accuracy and repeatability, which is the domain of traditional and dedicated machine vision cameras.

Scorpion Vision offers a complete range of industrial cameras and optics, from low cost, low resolution embedded cameras and boards to high resolution cameras with large sensors for more demanding machine vision applications. Scorpion’s expansive catalogue of hardware and software products provides state-of-the-art building blocks for OEMs and system integrators. Scorpion represents HIKROBOT, The Imaging Source, Arducam and Hypersen in the UK and Ireland for industrial cameras and other accessories.

Relec Electronics is exhibiting its extensive range of displays and power products at Southern Manufacturing & Electronics 2023 (Farnborough International, Farnborough, 7-9 January).

This year, marks the 10th appearance of Relec Electronics at Southern Manufacturing & Electronics.

Relec is highlighting its comprehensive range of AC-DC power supplies, DC-DC converters, DC-AC inverters and display technology on its stand (D70). Relec offers a wide range of panel PCs, consisting of a TFT display, a touch panel, CPU, memory and I/O ports, all in an IP65-rated enclosure. Sizes range from 10.1” to 23.8”, with many medically certified (60601). Relec also offers IPS, HDMI and TFT touch panel display solutions for medical, industrial, railway and military applications.

Relec is also highlighting its range of enclosed monitors, popular with manufacturers and system builders as a quick and easy way to integrate a display into equipment, via the VESA and flange brackets supplied.

Monitors available are suitable for indoor, outdoor, and harsh environments and integrate high brightness backlights, high contrast ratios and optical bonding to optimise outdoor viewing and readability.

The monitors include IPS technology for complete viewing angles and a bonded PCAP touch panel. They also use HDMI as the video input and include an audio line out and ambient light sensor for automatic dimming.

In addition to standard, catalogue products, Relec’s expertise and experience means it can offer a custom solution. Its team of experts is able to discuss and advise on applications, specifications and governing standards for a wide range of industries and applications, from transportation to high-rel. For example, in display technology, it offers enhancements to standard panels, including optical bonding, films to reduce glare, anti-bacterial and anti-fingerprint treatments.

Adding value to power products includes providing unique options and enhancements in all catalogue lines Relec supplies, a range of manufacturing services, such as sub-assemblies and finished products. In addition, many products complement one another, allowing customers to source many of their power supplies and displays from a single, reliable supplier.

Visit Relec Electronics at Southern Manufacturing & Electronics 2023, Stand D70, at Farnborough International GU14 6TQ from Tuesday 7th – Thursday 9th January.

Anritsu has announced that, as a member of both the O-RAN ALLIANCE and TIP OpenRAN Project Group, it has successfully participated in three O-RAN Global PlugFest Fall 2022 venues as follows:

• Kanagawa, Japan. PlugFest in Japan hosted by KDDI, NTT DOCOMO, Rakuten Mobile, Softbank and Yokosuka Research Park (YRP) at Japan OTIC (Open Testing and Integration Centre). Anritsu joined the PlugFest in collaboration with Rakuten Mobile Inc. and NEC Corporation. The testbed consisted of NEC’s O-RU and Anritsu’s O-RAN solution. At the PlugFest, O-RAN WG4 conformance tests were conducted by O-RAN WG4 defined S/M/C/U-Plane test scenarios. In addition, E2E (End to End) throughput performance was evaluated by adding timing errors at the S-Plane.
• Durham, North America. PlugFest hosted by University of New Hampshire’s Interoperability Laboratory (UNH-IOL). Anritsu joined the PlugFest in collaboration with Fujitsu Limited (later referred to as Fujitsu). The testbed consisted of Fujitsu’s O-RU (O-RAN Radio Unit) and Anritsu’s O-RAN test solution. At the PlugFest, “Time Error Injection Tests” on S-Plane and functional tests on status change messages reported by O-RU were validated, together with O-RAN WG4 defined S/M/C/U-Plane test scenarios.

Anritsu’s O-RAN test solution used at the venues consisted of Anritsu’s O-DU Emulator, Network Master Pro MT1000A and Signal Analyzer MS2850A.

In addition, Anritsu participated in the Joint European O-RAN and TIP PlugFest hosted by Deutsche Telekom, EANTC and Vodafone in Berlin, Germany. Anritsu offered its unique network tester, the MT1000A, for testbed synchronicity tests. The tester supports synchronicity tests for Sync-E, IEEE 1588 Packet Time Error and Wander Analysis.

By participating in the PlugFests, Anritsu is providing diversity in testing the O-RAN ecosystem and contributing to the construction of secure mobile networks by offering test scenarios that are a closer match to a real field network environment.

The Open Radio Access Network (O-RAN) has open interoperable interfaces that drives vendor diversity, increases innovation, and improves time to market. However, O-RAN provides more challenges for network synchronisation and requires more extensive interoperability and performance testing. The key O-RU testing challenges include how to reduce the complexity of setting O-RAN fronthaul parameters, how to accurately synchronise the device with all network elements, and how to qualify O-RU performance – not only with standardised test cases, but also using the test scenarios closer to a real field network situation. Anritsu is providing a unique O-RAN Test Platform to address these challenges.

The Signal Analyzer MS2850A, covering 9 kHz to 32 or 44.5 GHz, is a high-performance RF signal analyser supporting an analysis bandwidth up to 1 GHz. It also offers excellent flatness and a spurious-free dynamic range to support wideband communications measurements, such as 5G mobile communications and broadcast satellite equipment.

The Network Master Pro MT1000A is an all-in-one transport network tester for speeds from 1.5 Mbps to 100 Gbps using various technologies and supports PTP/SyncE tests in the Synchronization Plane (S-Plane).